Cai Qiaoming

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method for forming same
- Patent number 12,159,868
- Issue date Dec 3, 2024
- SEMICONDUCTOR MANUFACTURING NORTH CHINA (BEIJING) CORPORATION
- Cai Qiaoming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adapter board and method for forming same, packaging method, and pa...
- Patent number 12,068,233
- Issue date Aug 20, 2024
- SEMICONDUCTOR MANUFACTURING NORTH CHINA (BEIJING) CORPORATION
- Cai Qiaoming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adapter board and method for forming same, packaging method, and pa...
- Patent number 11,637,059
- Issue date Apr 25, 2023
- SEMICONDUCTOR MANUFACTURING NORTH CHINA (BEIJING) CORPORATION
- Cai Qiaoming
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADAPTER BOARD AND METHOD FOR FORMING SAME, PACKAGING METHOD, AND PA...
- Publication number 20230223329
- Publication date Jul 13, 2023
- Semiconductor Manufacturing North China (Beijing) Corporation
- Cai Qiaoming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20220293593
- Publication date Sep 15, 2022
- Semiconductor Manufacturing North China (Beijing) Corporation
- Cai QIAOMING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTER BOARD AND METHOD FOR FORMING SAME, PACKAGING METHOD, AND PA...
- Publication number 20210398892
- Publication date Dec 23, 2021
- Semiconductor Manufacturing North China (Beijing) Corporation
- Cai Qiaoming
- H01 - BASIC ELECTRIC ELEMENTS