TREA

Cai Wang

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  • Milford, CT, US
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    COPPER FILLING OF THROUGH SILICON VIAS
    • Publication number 20190003068
    • Publication date Jan 3, 2019
    • Enthone Inc.
    • Thomas B. Richardson
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Process for Filling Vias in the Microelectronics
    • Publication number 20160254156
    • Publication date Sep 1, 2016
    • Enthone Inc.
    • Thomas B. Richardson
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PROCESS FOR FILLING VIAS IN THE MICROELECTRONICS
    • Publication number 20140120722
    • Publication date May 1, 2014
    • Enthone Inc.
    • Thomas B. Richardson
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    COPPER FILLING OF THROUGH SILICON VIAS
    • Publication number 20130199935
    • Publication date Aug 8, 2013
    • Enthone Inc.
    • Thomas B. Richardson
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    IMMERSION TIN SILVER PLATING IN ELECTRONICS MANUFACTURE
    • Publication number 20110097597
    • Publication date Apr 28, 2011
    • Enthone Inc.
    • Yung-Herng Yau
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    METALLIC SURFACE ENHANCEMENT
    • Publication number 20100151263
    • Publication date Jun 17, 2010
    • Enthone Inc.
    • Joseph A. Abys
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    COPPER METALLIZATION OF THROUGH SILICON VIA
    • Publication number 20090035940
    • Publication date Feb 5, 2009
    • Enthone Inc.
    • Thomas B. Richardson
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR