Caleb C. Han

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Phoenix, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame array package with flip chip die attach
- Patent number 8,969,139
- Issue date Mar 3, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Caleb C. Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame array package with flip chip die attach
- Patent number 8,710,636
- Issue date Apr 29, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Caleb C. Han
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME ARRAY PACKAGE WITH FLIP CHIP DIE ATTACH
- Publication number 20140220738
- Publication date Aug 7, 2014
- Freescale Semiconductor Inc.
- CALEB C. HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR WAFER AND STRIP LEVEL BATCH DIE ATTACH ASSEMBLY
- Publication number 20130285259
- Publication date Oct 31, 2013
- Caleb C. Han
- B81 - MICRO-STRUCTURAL TECHNOLOGY