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Caleb Million Tessema
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Portland, OR, US
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Patent Application
INTEGRATED CIRCUIT PACKAGES WITH FLUID SPACERS TO IMPROVE PIN LOAD...
Publication number
20240413054
Publication date
Dec 12, 2024
Intel Corporation
Min Pei
H01 - BASIC ELECTRIC ELEMENTS
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MODULAR LOW LEVEL CONTACT RESISTANCE TESTING APPARATUS FOR PROCESS...
Publication number
20240133945
Publication date
Apr 25, 2024
Mohanraj Prabhugoud
G01 - MEASURING TESTING