Calvert Tan

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming through-silicon-via with...
- Patent number 9,076,655
- Issue date Jul 7, 2015
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Through-Silicon-Via with...
- Publication number 20140199838
- Publication date Jul 17, 2014
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS