Cam T. Nguyen

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Stack package for high density integrated circuits
- Patent number 7,217,994
- Issue date May 15, 2007
- Kyoćera Wireless Corp.
- Sherry Xiaoqi Zhu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for assembling a stack package for high density integrated...
- Patent number 7,151,010
- Issue date Dec 19, 2006
- Kyoćera Wireless Corp.
- Cam T. Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shield clip and method of securing a shield cover
- Patent number 6,267,629
- Issue date Jul 31, 2001
- QUALCOMM Incorporated
- Cam T. Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Methods for assembling a stack package for high density integrated...
- Publication number 20060115928
- Publication date Jun 1, 2006
- Cam T. Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stack package for high density integrated circuits
- Publication number 20060113653
- Publication date Jun 1, 2006
- Sherry Xiaoqi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR