Cameron Danesh

Person

Mountain View, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integration of OE devices with ICS
- Patent number 12,174,441
- Issue date Dec 24, 2024
- AvicenaTech, Corp.
- Robert Kalman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
P-type doping in GaN LEDs for high speed operation at low current d...
- Patent number 12,132,146
- Issue date Oct 29, 2024
- AvicenaTech, Corp.
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED chip-to-chip vertically launched optical communications with op...
- Patent number 12,101,128
- Issue date Sep 24, 2024
- AvicenaTech, Corp.
- Bardia Pezeshki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Hybrid integration of microLED interconnects with ICs
- Patent number 12,101,122
- Issue date Sep 24, 2024
- AVICENATECH CORP.
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Enhanced microLEDs for inter-chip communications
- Patent number 12,034,096
- Issue date Jul 9, 2024
- AVICENATECH CORP.
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallel optical communication channels using microLEDs
- Patent number 11,916,598
- Issue date Feb 27, 2024
- AVICENATECH CORP.
- Robert T. Weverka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Embedding LEDs with waveguides
- Patent number 11,906,779
- Issue date Feb 20, 2024
- AVICENATECH CORP.
- Robert Kalman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect networks using microLED-based optical links
- Patent number 11,824,590
- Issue date Nov 21, 2023
- AVICENATECH CORP.
- Robert Kalman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of OE devices with ICs
- Patent number 11,822,138
- Issue date Nov 21, 2023
- AVICENATECH CORP.
- Robert Kalman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer planar waveguide interconnects
- Patent number 11,815,712
- Issue date Nov 14, 2023
- AVICENATECH CORP.
- Robert Kalman
- G02 - OPTICS
Information Patent Grant
P-type doping in GaN LEDs for high speed operation at low current d...
- Patent number 11,810,995
- Issue date Nov 7, 2023
- AVICENATECH CORP.
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coherent fiber bundle parallel optical links
- Patent number 11,791,901
- Issue date Oct 17, 2023
- AVICENATECH CORP.
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
LED chip-to-chip vertically launched optical communications with op...
- Patent number 11,764,878
- Issue date Sep 19, 2023
- AVICENATECH CORP.
- Bardia Pezeshki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optically-enhanced multichip packaging
- Patent number 11,728,894
- Issue date Aug 15, 2023
- AVICENATECH CORP.
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Hybrid integration of microLED interconnects with ICs
- Patent number 11,677,472
- Issue date Jun 13, 2023
- AVICENATECH CORP.
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Embedding LEDs with waveguides
- Patent number 11,619,781
- Issue date Apr 4, 2023
- AVICENATECH CORP.
- Robert Kalman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED array for in-plane optical interconnects
- Patent number 11,605,618
- Issue date Mar 14, 2023
- AVICENATECH CORP.
- Michael Krames
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coherent fiber bundle parallel optical links
- Patent number 11,476,942
- Issue date Oct 18, 2022
- AVICENATECH CORP.
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
COHERENT FIBER BUNDLE PARALLEL OPTICAL LINKS
- Publication number 20240305379
- Publication date Sep 12, 2024
- AVICENATECH CORP.
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTERCONNECT NETWORKS USING MICROLED-BASED OPTICAL LINKS
- Publication number 20240235697
- Publication date Jul 11, 2024
- AVICENATECH CORP.
- Robert Kalman
- G02 - OPTICS
Information Patent Application
INTERCONNECT NETWORKS USING MICROLED-BASED OPTICAL LINKS
- Publication number 20240137132
- Publication date Apr 25, 2024
- AVICENATECH CORP.
- Robert Kalman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF OE DEVICES WITH ICS
- Publication number 20240053558
- Publication date Feb 15, 2024
- AVICENATECH CORP.
- Robert Kalman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER PLANAR WAVEGUIDE INTERCONNECTS
- Publication number 20240036246
- Publication date Feb 1, 2024
- AVICENATECH CORP.
- Robert Kalman
- G02 - OPTICS
Information Patent Application
P-TYPE DOPING IN GAN LEDS FOR HIGH SPEED OPERATION AT LOW CURRENT D...
- Publication number 20240030377
- Publication date Jan 25, 2024
- AVICENATECH CORP.
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COHERENT FIBER BUNDLE PARALLEL OPTICAL LINKS
- Publication number 20240022330
- Publication date Jan 18, 2024
- AVICENATECH CORP.
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COUPLING MICROLEDS TO OPTICAL COMMUNICATION CHANNELS
- Publication number 20240012215
- Publication date Jan 11, 2024
- AVICENATECH CORP.
- Robert Kalman
- G02 - OPTICS
Information Patent Application
LED CHIP-TO-CHIP VERTICALLY LAUNCHED OPTICAL COMMUNICATIONS WITH OP...
- Publication number 20230412282
- Publication date Dec 21, 2023
- AVICENATECH CORP.
- Bardia Pezeshki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICALLY-ENHANCED MULTICHIP PACKAGING
- Publication number 20230344518
- Publication date Oct 26, 2023
- AVICENATECH CORP.
- Robert Kalman
- G02 - OPTICS
Information Patent Application
HYBRID INTEGRATION OF MICROLED INTERCONNECTS WITH ICS
- Publication number 20230299854
- Publication date Sep 21, 2023
- AVICENATECH CORP.
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
EMBEDDING LEDS WITH WAVEGUIDES
- Publication number 20230296835
- Publication date Sep 21, 2023
- AVICENATECH CORP.
- Robert Kalman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL MICROLED-BASED FREE SPACE OPTICAL INTERCONNECTS
- Publication number 20230268999
- Publication date Aug 24, 2023
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LED ARRAY FOR IN-PLANE OPTICAL INTERCONNECTS
- Publication number 20230197695
- Publication date Jun 22, 2023
- AVICENATECH CORP.
- Michael Krames
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATE OPTOELECTRONIC SUBSTRATE
- Publication number 20230129843
- Publication date Apr 27, 2023
- Robert Kalman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROLED PARALLEL OPTICAL INTERCONNECTS
- Publication number 20230054560
- Publication date Feb 23, 2023
- Robert Kalman
- G02 - OPTICS
Information Patent Application
COHERENT FIBER BUNDLE PARALLEL OPTICAL LINKS
- Publication number 20230020634
- Publication date Jan 19, 2023
- AVICENATECH CORP.
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LED CHIP-TO-CHIP VERTICALLY LAUNCHED OPTICAL COMMUNICATIONS WITH OP...
- Publication number 20220286211
- Publication date Sep 8, 2022
- Bardia Pezeshki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
P-TYPE DOPING IN GAN LEDS FOR HIGH SPEED OPERATION AT LOW CURRENT D...
- Publication number 20220181517
- Publication date Jun 9, 2022
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
P-TYPE DOPING IN GAN LEDS FOR HIGH SPEED OPERATION AT LOW CURRENT D...
- Publication number 20220181518
- Publication date Jun 9, 2022
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF OE DEVICES WITH ICS
- Publication number 20220113483
- Publication date Apr 14, 2022
- Robert Kalman
- G02 - OPTICS
Information Patent Application
MULTI-LAYER PLANAR WAVEGUIDE INTERCONNECTS
- Publication number 20220107456
- Publication date Apr 7, 2022
- Robert Kalman
- G02 - OPTICS
Information Patent Application
HYBRID INTEGRATION OF MICROLED INTERCONNECTS WITH ICS
- Publication number 20220069914
- Publication date Mar 3, 2022
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ENHANCED MICROLEDS FOR INTER-CHIP COMMUNICATIONS
- Publication number 20220045234
- Publication date Feb 10, 2022
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS-COMPATIBLE SHORT WAVELENGTH PHOTODETECTORS
- Publication number 20220005845
- Publication date Jan 6, 2022
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COHERENT FIBER BUNDLE PARALLEL OPTICAL LINKS
- Publication number 20210376932
- Publication date Dec 2, 2021
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
EMBEDDING LEDS WITH WAVEGUIDES
- Publication number 20210356662
- Publication date Nov 18, 2021
- Robert Kalman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL OPTICAL COMMUNICATION CHANNELS USING MICROLEDS
- Publication number 20210320721
- Publication date Oct 14, 2021
- Robert T. Weverka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTERCONNECT NETWORKS USING MICROLED-BASED OPTICAL LINKS
- Publication number 20210320726
- Publication date Oct 14, 2021
- Robert Kalman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLING MICROLEDS TO OPTICAL COMMUNICATION CHANNELS
- Publication number 20210318503
- Publication date Oct 14, 2021
- Robert Kalman
- H01 - BASIC ELECTRIC ELEMENTS

Cameron Danesh

Person

Patents Grantslast 30 patents

Integration of OE devices with ICS

P-type doping in GaN LEDs for high speed operation at low current d...

LED chip-to-chip vertically launched optical communications with op...

Hybrid integration of microLED interconnects with ICs

Enhanced microLEDs for inter-chip communications

Parallel optical communication channels using microLEDs

Embedding LEDs with waveguides

Interconnect networks using microLED-based optical links

Integration of OE devices with ICs

Multi-layer planar waveguide interconnects

P-type doping in GaN LEDs for high speed operation at low current d...

Coherent fiber bundle parallel optical links

LED chip-to-chip vertically launched optical communications with op...

Optically-enhanced multichip packaging

Hybrid integration of microLED interconnects with ICs

Embedding LEDs with waveguides

LED array for in-plane optical interconnects

Coherent fiber bundle parallel optical links

Patents Applicationslast 30 patents

COHERENT FIBER BUNDLE PARALLEL OPTICAL LINKS

INTERCONNECT NETWORKS USING MICROLED-BASED OPTICAL LINKS

INTERCONNECT NETWORKS USING MICROLED-BASED OPTICAL LINKS

INTEGRATION OF OE DEVICES WITH ICS

MULTI-LAYER PLANAR WAVEGUIDE INTERCONNECTS

P-TYPE DOPING IN GAN LEDS FOR HIGH SPEED OPERATION AT LOW CURRENT D...

COHERENT FIBER BUNDLE PARALLEL OPTICAL LINKS

COUPLING MICROLEDS TO OPTICAL COMMUNICATION CHANNELS

LED CHIP-TO-CHIP VERTICALLY LAUNCHED OPTICAL COMMUNICATIONS WITH OP...

OPTICALLY-ENHANCED MULTICHIP PACKAGING

HYBRID INTEGRATION OF MICROLED INTERCONNECTS WITH ICS

EMBEDDING LEDS WITH WAVEGUIDES

PARALLEL MICROLED-BASED FREE SPACE OPTICAL INTERCONNECTS

LED ARRAY FOR IN-PLANE OPTICAL INTERCONNECTS

SEPARATE OPTOELECTRONIC SUBSTRATE

MICROLED PARALLEL OPTICAL INTERCONNECTS

COHERENT FIBER BUNDLE PARALLEL OPTICAL LINKS

LED CHIP-TO-CHIP VERTICALLY LAUNCHED OPTICAL COMMUNICATIONS WITH OP...

P-TYPE DOPING IN GAN LEDS FOR HIGH SPEED OPERATION AT LOW CURRENT D...

P-TYPE DOPING IN GAN LEDS FOR HIGH SPEED OPERATION AT LOW CURRENT D...

INTEGRATION OF OE DEVICES WITH ICS

MULTI-LAYER PLANAR WAVEGUIDE INTERCONNECTS

HYBRID INTEGRATION OF MICROLED INTERCONNECTS WITH ICS

ENHANCED MICROLEDS FOR INTER-CHIP COMMUNICATIONS

CMOS-COMPATIBLE SHORT WAVELENGTH PHOTODETECTORS

COHERENT FIBER BUNDLE PARALLEL OPTICAL LINKS

EMBEDDING LEDS WITH WAVEGUIDES

PARALLEL OPTICAL COMMUNICATION CHANNELS USING MICROLEDS

INTERCONNECT NETWORKS USING MICROLED-BASED OPTICAL LINKS

COUPLING MICROLEDS TO OPTICAL COMMUNICATION CHANNELS