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Mesa, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Process of forming an electronic device including a ball bond
- Patent number 9,812,424
- Issue date Nov 7, 2017
- Semiconductor Components Industries, LLC
- Harold G. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacture
- Patent number 7,382,059
- Issue date Jun 3, 2008
- Semiconductor Components Industries, LLC
- Harold G. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with wire bond inductor and method
- Patent number 7,227,240
- Issue date Jun 5, 2007
- Semiconductor Components Industries, LLC
- James Knapp
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICES AND PROCESS OF FORMING THE SAME
- Publication number 20170179074
- Publication date Jun 22, 2017
- Semiconductor Components Industries, LLC
- Harold G. ANDERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package structure and method of manufacture
- Publication number 20070114676
- Publication date May 24, 2007
- Semiconductor Components Industries, LLC.
- Harold G. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component and method of manufacture
- Publication number 20070117259
- Publication date May 24, 2007
- Semiconductor Components Industries, LLC.
- Harold G. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with wire bond inductor and method
- Publication number 20050285262
- Publication date Dec 29, 2005
- James Knapp
- H01 - BASIC ELECTRIC ELEMENTS