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last 30 patents
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Patent Grant
Mounting material, semiconductor device and method of manufacturing...
Patent number
6,949,814
Issue date
Sep 27, 2005
Kabushiki Kaisha Toshiba
Cao Minh Thai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device provided with heat-sink and method of manufact...
Patent number
6,225,701
Issue date
May 1, 2001
Kabushiki Kaisha Toshiba
Tetsuji Hori
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a molding using a filler or an additive con...
Patent number
5,589,129
Issue date
Dec 31, 1996
Kabushiki Kaisha Toshiba
Tsuguo Kato
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Patent Grant
Resin-encapsulated semiconductor device
Patent number
5,536,970
Issue date
Jul 16, 1996
Kabushiki Kaisha Toshiba
Michiya Higashi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Mounting material, semiconductor device and method of manufacturing...
Publication number
20030111728
Publication date
Jun 19, 2003
Cao Minh Thai
H01 - BASIC ELECTRIC ELEMENTS