Captain Chen

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Yungkang City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing wafer level chip size package
- Patent number 6,521,485
- Issue date Feb 18, 2003
- Walsin Advanced Electronics Ltd.
- Spencer Su
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for manufacturing wafer level chip size package
- Publication number 20020094601
- Publication date Jul 18, 2002
- Walsin Advanced Electronics LTD
- Spencer Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing chip size package and its structure
- Publication number 20020094683
- Publication date Jul 18, 2002
- Walsin Advanced Electronics LTD
- Spencer Su
- H01 - BASIC ELECTRIC ELEMENTS