Carl Alvin Dilao

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Adhesive for electronic components, and manufacturing method for se...
- Patent number 9,011,629
- Issue date Apr 21, 2015
- Sekisui Chemical Co., Ltd.
- Carl Alvin Dilao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for semiconductor bonding, adhesive film for semiconductor...
- Patent number 8,692,394
- Issue date Apr 8, 2014
- Sekisui Chemical Co., Ltd.
- Yangsoo Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE FOR ELECTRONIC COMPONENTS, AND MANUFACTURING METHOD FOR SE...
- Publication number 20130237018
- Publication date Sep 12, 2013
- Sekisui Chemical Co., Ltd
- Carl Alvin Dilao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMOSETTING RESIN COMPOSITION, FLIP-CHIP MOUNTING ADHESIVE, SEMIC...
- Publication number 20120326301
- Publication date Dec 27, 2012
- SEKISUI CHEMICAL CO., LTD.
- Sayaka Wakioka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR BONDING, ADHESIVE FILM FOR SEMICONDUCTOR...
- Publication number 20120267803
- Publication date Oct 25, 2012
- Sekisui Chemical Co., Ltd
- Yangsoo Lee
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...