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Carl E. D'Acosta
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Mesa, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Air cavity packages and methods for the production thereof
Patent number
9,922,894
Issue date
Mar 20, 2018
NXP USA, INC.
Lakshminarayan Viswanathan
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Die-to-die inductive communication devices and methods
Patent number
9,466,413
Issue date
Oct 11, 2016
FREESCALE SEMICONDUCTOR, INC.
Fred T. Brauchler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked device assembly with integrated coil and method of forming...
Patent number
7,868,729
Issue date
Jan 11, 2011
FREESCALE SEMICONDUCTOR, INC.
James Jen-Ho Wang
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Method of etching a semiconductor substrate
Patent number
5,851,928
Issue date
Dec 22, 1998
Motorola, Inc.
Jerry D. Cripe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ion implanter with beam resolving apparatus and method for implanti...
Patent number
5,306,920
Issue date
Apr 26, 1994
Motorola, Inc.
Jerry S. King
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
Publication number
20180082915
Publication date
Mar 22, 2018
Freescale Semiconductor Inc.
LAKSHMINARAYAN VISWANATHAN
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DIE-TO-DIE INDUCTIVE COMMUNICATION DEVICES AND METHODS
Publication number
20150004902
Publication date
Jan 1, 2015
John M. PIGOTT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE-TO-DIE INDUCTIVE COMMUNICATION DEVICES AND METHODS
Publication number
20150001948
Publication date
Jan 1, 2015
Fred T. BRAUCHLER
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING BACKSIDE CONTACT AND METHOD FOR...
Publication number
20140167247
Publication date
Jun 19, 2014
FREESCALE SEMICONDUCTOR IN.
ALAN J. MAGNUS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED DEVICE ASSEMBLY WITH INTEGRATED COIL AND METHOD OF FORMING...
Publication number
20100225434
Publication date
Sep 9, 2010
FREESCALE SEMICONDUCTOR, INC.
James Jen-Ho Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Micro-electro-mechanical systems device and integrated circuit devi...
Publication number
20080128901
Publication date
Jun 5, 2008
Peter Zurcher
B81 - MICRO-STRUCTURAL TECHNOLOGY