Carl L. Deppisch

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Varied ball ball-grid-array (BGA) packages
- Patent number 11,916,003
- Issue date Feb 27, 2024
- Intel Corporation
- Xiao Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Foam composite
- Patent number 10,651,108
- Issue date May 12, 2020
- Intel Corporation
- Zhizhong Tang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Package structure to enhance yield of TMI interconnections
- Patent number 10,049,971
- Issue date Aug 14, 2018
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating low melting point solder reinforced sealant...
- Patent number 9,808,875
- Issue date Nov 7, 2017
- Intel Corporation
- Deepak V. Kulkarni
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure to enhance yield of TMI interconnections
- Patent number 9,613,933
- Issue date Apr 4, 2017
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-component integrated heat spreader for multi-chip packages
- Patent number 9,330,999
- Issue date May 3, 2016
- Intel Corporation
- Thomas J. Fitzgerald
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods of fabricating low melting point solder reinforced sealant...
- Patent number 9,254,532
- Issue date Feb 9, 2016
- Intel Corporation
- Deepak V. Kulkarni
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-solder techniques and configurations for integrated circuit p...
- Patent number 9,257,405
- Issue date Feb 9, 2016
- Intel Corporation
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-solder techniques and configurations for integrated circuit p...
- Patent number 8,809,181
- Issue date Aug 19, 2014
- Intel Corporation
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clad solder thermal interface material
- Patent number 8,550,327
- Issue date Oct 8, 2013
- Intel Corporation
- Carl L. Deppisch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming a semiconductor package including a thermal interface material
- Patent number 8,409,929
- Issue date Apr 2, 2013
- Intel Corporation
- Mukul Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite solder TIM for electronic package
- Patent number 8,242,602
- Issue date Aug 14, 2012
- Intel Corporation
- Tom Fitzgerald
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of fabricating robust integrated heat spreader designs and...
- Patent number 8,174,113
- Issue date May 8, 2012
- Intel Corporation
- Abhishek Gupta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming a semiconductor package including a thermal interface material
- Patent number 8,030,757
- Issue date Oct 4, 2011
- Intel Corporation
- Mukul Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated thermal interface in integrated circuit die
- Patent number 7,955,900
- Issue date Jun 7, 2011
- Intel Corporation
- Susheel G. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink with preattached thermal interface material and method of...
- Patent number 7,821,126
- Issue date Oct 26, 2010
- Intel Corporation
- Sabina J. Houle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite solder TIM for electronic package
- Patent number 7,816,250
- Issue date Oct 19, 2010
- Intel Corporation
- Tom Fitzgerald
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reactive gettering in phase change solders to inhibit oxidation at...
- Patent number 7,727,815
- Issue date Jun 1, 2010
- Intel Corporation
- Chad A. Kumaus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assemblies with hot spot cooling and methods relating th...
- Patent number 7,704,798
- Issue date Apr 27, 2010
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packaging apparatus and method
- Patent number 7,672,132
- Issue date Mar 2, 2010
- Intel Corporation
- Thomas J Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ alloyed solders, articles made thereby, and processes of ma...
- Patent number 7,494,041
- Issue date Feb 24, 2009
- Intel Corporation
- Edward L. Martin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly with hot spot cooling
- Patent number 7,489,033
- Issue date Feb 10, 2009
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capillary underflow integral heat spreader
- Patent number 7,439,617
- Issue date Oct 21, 2008
- Intel Corporation
- Carl Deppisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reactive solder material
- Patent number 7,436,058
- Issue date Oct 14, 2008
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink with preattached thermal interface material and method of...
- Patent number 7,416,922
- Issue date Aug 26, 2008
- Intel Corporation
- Sabina J. Houle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly having an indium wetting layer on a thermally c...
- Patent number 7,362,580
- Issue date Apr 22, 2008
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for package warp compensation in an integrated he...
- Patent number 7,256,058
- Issue date Aug 14, 2007
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of a coating heat spreader
- Patent number 7,219,421
- Issue date May 22, 2007
- Intel Corporation
- Joan K. Vrtis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface apparatus, systems, and methods
- Patent number 7,164,585
- Issue date Jan 16, 2007
- Intel Corporation
- Susheel G. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packaging apparatus and method
- Patent number 7,160,758
- Issue date Jan 9, 2007
- Intel Corporation
- Thomas J Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES
- Publication number 20240162134
- Publication date May 16, 2024
- Intel Corporation
- Xiao LU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES
- Publication number 20210082798
- Publication date Mar 18, 2021
- Intel Corporation
- Xiao LU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FOAM COMPOSITE
- Publication number 20180005917
- Publication date Jan 4, 2018
- Zhizhong Tang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Package Structure To Enhance Yield of TMI Interconnections
- Publication number 20170207152
- Publication date Jul 20, 2017
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ON SUBSTRATE PACKAGE
- Publication number 20170053858
- Publication date Feb 23, 2017
- Intel Corporation
- Jan Krajniak
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FABRICATING LOW MELTING POINT SOLDER REINFORCED SEALANT...
- Publication number 20160151850
- Publication date Jun 2, 2016
- Intel Corporation
- Deepak V. Kulkarni
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-COMPONENT INTEGRATED HEAT SPREADER FOR MULTI-CHIP PACKAGES
- Publication number 20150357258
- Publication date Dec 10, 2015
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure To Enhance Yield of TMI Interconnections
- Publication number 20150255415
- Publication date Sep 10, 2015
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-SOLDER TECHNIQUES AND CONFIGURATIONS FOR INTEGRATED CIRCUIT P...
- Publication number 20140319682
- Publication date Oct 30, 2014
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-SOLDER TECHNIQUES AND CONFIGURATIONS FOR INTEGRATED CIRCUIT P...
- Publication number 20140124925
- Publication date May 8, 2014
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Forming A Semiconductor Package Including A Thermal Interface Material
- Publication number 20110312131
- Publication date Dec 22, 2011
- Mukul Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of fabricating low melting point solder reinforced sealant...
- Publication number 20110159310
- Publication date Jun 30, 2011
- Intel Corporation
- Deepak V. Kulkarni
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Clad Solder Thermal Interface Material
- Publication number 20110147914
- Publication date Jun 23, 2011
- Carl L. Deppisch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CLAD SOLDER THERMAL INTERFACE MATERIAL
- Publication number 20110147438
- Publication date Jun 23, 2011
- Carl Ludwig Deppisch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE SOLDER TIM FOR ELECTRONIC PACKAGE
- Publication number 20100259890
- Publication date Oct 14, 2010
- Tom Fitzgerald
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of fabricating robust integrated heat spreader designs and...
- Publication number 20100065246
- Publication date Mar 18, 2010
- Abhishek Gupta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLIES WITH HOT SPOT COOLING AND METHODS RELATING TH...
- Publication number 20090093072
- Publication date Apr 9, 2009
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming a semiconductor package including a thermal interface material
- Publication number 20090001557
- Publication date Jan 1, 2009
- Mukul Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reactive solder material
- Publication number 20080293188
- Publication date Nov 27, 2008
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flux precoated solder preform for thermal interface material
- Publication number 20080239660
- Publication date Oct 2, 2008
- Lateef Mustapha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK WITH PREATTACHED THERMAL INTERFACE MATERIAL AND METHOD OF...
- Publication number 20080174007
- Publication date Jul 24, 2008
- Intel Corporation
- Sabina J. Houle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY HAVING AN INDIUM WETTING LAYER ON A THERMALLY C...
- Publication number 20080153210
- Publication date Jun 26, 2008
- Fay HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY WITH HOT SPOT COOLING
- Publication number 20080111234
- Publication date May 15, 2008
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite solder TIM for electronic package
- Publication number 20080090405
- Publication date Apr 17, 2008
- Tom Fitzgerald
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capillary underflow integral heat spreader
- Publication number 20080017975
- Publication date Jan 24, 2008
- Carl Deppisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED THERMAL INTERFACE IN INTEGRATED CIRCUIT DIE
- Publication number 20070231967
- Publication date Oct 4, 2007
- Susheel G. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and arrangement for forming a microelectronic package
- Publication number 20070228112
- Publication date Oct 4, 2007
- Wei Shi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGING APPARATUS AND METHOD
- Publication number 20070097650
- Publication date May 3, 2007
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated solder and heat spreader fabrication
- Publication number 20070035012
- Publication date Feb 15, 2007
- Carl L. Deppisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR PACKAGE WARP COMPENSATION IN AN INTEGRATED HE...
- Publication number 20070020813
- Publication date Jan 25, 2007
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS

Carl L. Deppisch

Person

Patents Grantslast 30 patents

Varied ball ball-grid-array (BGA) packages

Foam composite

Package structure to enhance yield of TMI interconnections

Methods of fabricating low melting point solder reinforced sealant...

Package structure to enhance yield of TMI interconnections

Multi-component integrated heat spreader for multi-chip packages

Methods of fabricating low melting point solder reinforced sealant...

Multi-solder techniques and configurations for integrated circuit p...

Multi-solder techniques and configurations for integrated circuit p...

Clad solder thermal interface material

Forming a semiconductor package including a thermal interface material

Composite solder TIM for electronic package

Methods of fabricating robust integrated heat spreader designs and...

Forming a semiconductor package including a thermal interface material

Coated thermal interface in integrated circuit die

Heat sink with preattached thermal interface material and method of...

Composite solder TIM for electronic package

Reactive gettering in phase change solders to inhibit oxidation at...

Electronic assemblies with hot spot cooling and methods relating th...

Electronic packaging apparatus and method

In-situ alloyed solders, articles made thereby, and processes of ma...

Electronic assembly with hot spot cooling

Capillary underflow integral heat spreader

Reactive solder material

Heat sink with preattached thermal interface material and method of...

Electronic assembly having an indium wetting layer on a thermally c...

Device and method for package warp compensation in an integrated he...

Method of a coating heat spreader

Thermal interface apparatus, systems, and methods

Electronic packaging apparatus and method

Patents Applicationslast 30 patents

VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES

VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES

FOAM COMPOSITE

Package Structure To Enhance Yield of TMI Interconnections

SUBSTRATE ON SUBSTRATE PACKAGE

METHODS OF FABRICATING LOW MELTING POINT SOLDER REINFORCED SEALANT...

MULTI-COMPONENT INTEGRATED HEAT SPREADER FOR MULTI-CHIP PACKAGES

Package Structure To Enhance Yield of TMI Interconnections

MULTI-SOLDER TECHNIQUES AND CONFIGURATIONS FOR INTEGRATED CIRCUIT P...

MULTI-SOLDER TECHNIQUES AND CONFIGURATIONS FOR INTEGRATED CIRCUIT P...

Forming A Semiconductor Package Including A Thermal Interface Material

Methods of fabricating low melting point solder reinforced sealant...

Clad Solder Thermal Interface Material

CLAD SOLDER THERMAL INTERFACE MATERIAL

COMPOSITE SOLDER TIM FOR ELECTRONIC PACKAGE

Methods of fabricating robust integrated heat spreader designs and...

ELECTRONIC ASSEMBLIES WITH HOT SPOT COOLING AND METHODS RELATING TH...

Forming a semiconductor package including a thermal interface material

Reactive solder material

Flux precoated solder preform for thermal interface material

HEAT SINK WITH PREATTACHED THERMAL INTERFACE MATERIAL AND METHOD OF...

ELECTRONIC ASSEMBLY HAVING AN INDIUM WETTING LAYER ON A THERMALLY C...

ELECTRONIC ASSEMBLY WITH HOT SPOT COOLING

Composite solder TIM for electronic package

Capillary underflow integral heat spreader

COATED THERMAL INTERFACE IN INTEGRATED CIRCUIT DIE

Method and arrangement for forming a microelectronic package

ELECTRONIC PACKAGING APPARATUS AND METHOD

Integrated solder and heat spreader fabrication

DEVICE AND METHOD FOR PACKAGE WARP COMPENSATION IN AN INTEGRATED HE...