Carlo Marbella

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a copper pillar interconnect structure
- Patent number 11,152,321
- Issue date Oct 19, 2021
- Infineon Technologies AG
- Carlo Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates for semiconductor packages
- Patent number 10,937,709
- Issue date Mar 2, 2021
- Infineon Technologies AG
- Carlo Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and method for fabrication thereof
- Patent number 10,181,439
- Issue date Jan 15, 2019
- Infineon Technologies AG
- Carlo Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bridging prevention structures for circuit boards and semico...
- Patent number 10,085,353
- Issue date Sep 25, 2018
- Infineon Technologies AG
- Carlo Baterna Marbella
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor formation arrangement
- Patent number 9,387,613
- Issue date Jul 12, 2016
- Infineon Technologies AG
- Carlo Baterna Marbella
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of connecting a semiconductor package to a board
- Patent number 9,343,397
- Issue date May 17, 2016
- Infineon Technologies AG
- Carlo Marbella
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for an electronic package with a fail-open mechanism
- Patent number 9,082,737
- Issue date Jul 14, 2015
- Infineon Technologies AG
- Carlo Baterna Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for an electronic package with a fail-open mechanism
- Patent number 8,816,390
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Carlo Baterna Marbella
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Having a Copper Pillar Interconnect Structure
- Publication number 20200258855
- Publication date Aug 13, 2020
- Carlo Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES FOR SEMICONDUCTOR PACKAGES
- Publication number 20200227330
- Publication date Jul 16, 2020
- INFINEON TECHNOLOGIES AG
- Carlo Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND METHOD FOR FABRICATION THEREOF
- Publication number 20180315692
- Publication date Nov 1, 2018
- INFINEON TECHNOLOGIES AG
- Carlo Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Configured for Connection to a Board
- Publication number 20160329292
- Publication date Nov 10, 2016
- INFINEON TECHNOLOGIES AG
- Carlo Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT WITH IMPRINT, INTEGRA...
- Publication number 20160141187
- Publication date May 19, 2016
- INFINEON TECHNOLOGIES AG
- Carlo Baterna Marbella
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Device Package Configuration and Method for Compensating for Unbala...
- Publication number 20150336314
- Publication date Nov 26, 2015
- INFINEON TECHNOLOGIES AG
- Carlo Baterna Marbella
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of Connecting a Semiconductor Package to a Board
- Publication number 20150243593
- Publication date Aug 27, 2015
- INFINEON TECHNOLOGIES AG
- Carlo Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Bridging Prevention Structures for Circuit Boards and Semico...
- Publication number 20150131249
- Publication date May 14, 2015
- INFINEON TECHNOLOGIES AG
- Carlo Baterna Marbella
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and Method for an Electronic Package with a Fail-Open Mechanism
- Publication number 20140131844
- Publication date May 15, 2014
- INFINEON TECHNOLOGIES AG
- Carlo Baterna Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR AN ELECTRONIC PACKAGE WITH A FAIL-OPEN MECHANISM
- Publication number 20130194752
- Publication date Aug 1, 2013
- INFINEON TECHNOLOGIES AG
- Carlo Baterna Marbella
- H01 - BASIC ELECTRIC ELEMENTS

Carlo Marbella

Person

Patents Grantslast 30 patents

Semiconductor device having a copper pillar interconnect structure

Substrates for semiconductor packages

Substrate and method for fabrication thereof

Solder bridging prevention structures for circuit boards and semico...

Semiconductor formation arrangement

Method of connecting a semiconductor package to a board

System and method for an electronic package with a fail-open mechanism

System and method for an electronic package with a fail-open mechanism

Patents Applicationslast 30 patents

Semiconductor Device Having a Copper Pillar Interconnect Structure

SUBSTRATES FOR SEMICONDUCTOR PACKAGES

SUBSTRATE AND METHOD FOR FABRICATION THEREOF

Semiconductor Package Configured for Connection to a Board

METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT WITH IMPRINT, INTEGRA...

Device Package Configuration and Method for Compensating for Unbala...

Method of Connecting a Semiconductor Package to a Board

Solder Bridging Prevention Structures for Circuit Boards and Semico...

System and Method for an Electronic Package with a Fail-Open Mechanism

SYSTEM AND METHOD FOR AN ELECTRONIC PACKAGE WITH A FAIL-OPEN MECHANISM