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last 30 patents
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Patent Grant
Packages and methods for packaging
Patent number
9,142,470
Issue date
Sep 22, 2015
Analog Devices, Inc.
Jicheng Yang
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Patent Grant
Packages and methods for packaging using a lid having multiple cond...
Patent number
8,723,308
Issue date
May 13, 2014
Analog Devices, Inc.
Jicheng Yang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
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Patent Application
PACKAGES AND METHODS FOR PACKAGING
Publication number
20140332947
Publication date
Nov 13, 2014
Analog Devices, Inc.
Jicheng Yang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
PACKAGES AND METHODS FOR PACKAGING
Publication number
20120126347
Publication date
May 24, 2012
Analog Devices, Inc.
Jicheng Yang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Semiconductor dice with edge cavities
Publication number
20050056871
Publication date
Mar 17, 2005
Reginald T. Taar
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Semiconductor dice with edge cavities
Publication number
20040026768
Publication date
Feb 12, 2004
Reginald T. Taar
H01 - BASIC ELECTRIC ELEMENTS