Carlton E. Hanna

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Module installation on printed circuit boards with embedded trace t...
- Patent number 11,502,010
- Issue date Nov 15, 2022
- Intel Corporation
- Quan Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partially molded direct chip attach package structures for connecti...
- Patent number 10,332,821
- Issue date Jun 25, 2019
- Intel IP Corporation
- Quan Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated antenna for direct chip attach connectivity module packa...
- Patent number 10,103,088
- Issue date Oct 16, 2018
- Intel IP Corporation
- Quan Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partially molded direct chip attach package structures for connecti...
- Patent number 10,049,961
- Issue date Aug 14, 2018
- Intel IP Corporation
- Quan Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra slim RF package for ultrabooks and smart phones
- Patent number 8,890,628
- Issue date Nov 18, 2014
- Intel Corporation
- Vijay K. Nair
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
C4 joint reliability
- Patent number 7,656,035
- Issue date Feb 2, 2010
- Intel Corporation
- Sairam Agraharam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
C4 joint reliability
- Patent number 7,517,787
- Issue date Apr 14, 2009
- Intel Corporation
- Sairam Agraharam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with reduced stress on die and associat...
- Patent number 7,465,651
- Issue date Dec 16, 2008
- Intel Corporation
- Sairam Agraharam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal heater for in situ heating and crystallization of ferroelectr...
- Patent number 7,173,842
- Issue date Feb 6, 2007
- Intel Corporation
- Mark S. Isenberger
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit packages with reduced stress on die and associat...
- Patent number 6,989,586
- Issue date Jan 24, 2006
- Intel Corporation
- Sairam Agraharam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CHIP-FIRST LAYERED PACKAGING ARCHITECTURE
- Publication number 20230411348
- Publication date Dec 21, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS FOR SEMICONDUCTOR DEVICES
- Publication number 20230317620
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN CLIENT FORM FACTOR ASSEMBLY
- Publication number 20230317705
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE SUBSTRATE PRINTED CIRCUIT BOARD FOR WARPAGE REDUCTION
- Publication number 20230317582
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS BRIDGE FOR CONNECTING DIES
- Publication number 20230317618
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR IMPROVED HEAT DISSIPATION AND METHOD
- Publication number 20230307313
- Publication date Sep 28, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS
- Publication number 20230299014
- Publication date Sep 21, 2023
- Intel Corporation
- Abdallah Bacha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS
- Publication number 20230299012
- Publication date Sep 21, 2023
- Intel Corporation
- Mohan Prashanth Javare Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS
- Publication number 20230299013
- Publication date Sep 21, 2023
- Intel Corporation
- Abdallah Bacha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20220415806
- Publication date Dec 29, 2022
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20220415815
- Publication date Dec 29, 2022
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20220415814
- Publication date Dec 29, 2022
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20220415805
- Publication date Dec 29, 2022
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE INSTALLATION ON PRINTED CIRCUIT BOARDS WITH EMBEDDED TRACE T...
- Publication number 20190221488
- Publication date Jul 18, 2019
- Intel Corporation
- Quan QI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTIALLY MOLDED DIRECT CHIP ATTACH PACKAGE STRUCTURES FOR CONNECTI...
- Publication number 20190067163
- Publication date Feb 28, 2019
- Intel IP Corporation
- Quan Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING SOLUTIONS FOR DIRECT CHIP ATTACH CONNECTIVITY MODULE PACK...
- Publication number 20180286815
- Publication date Oct 4, 2018
- Intel IP Corporation
- Quan Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ANTENNA FOR DIRECT CHIP ATTACH CONNECTIVITY MODULE PACKA...
- Publication number 20180286780
- Publication date Oct 4, 2018
- Intel IP Corporation
- Quan Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA SLIM RF PACKAGE FOR ULTRABOOKS AND SMART PHONES
- Publication number 20140062607
- Publication date Mar 6, 2014
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
C4 JOINT RELIABILITY
- Publication number 20090115057
- Publication date May 7, 2009
- Sairam Agraharam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
C4 joint reliability
- Publication number 20060214292
- Publication date Sep 28, 2006
- Sairam Agraharam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit packages with reduced stress on die and associat...
- Publication number 20050266613
- Publication date Dec 1, 2005
- Intel Corporation
- Sairam Agraharam
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Metal heater for in situ heating and crystallization of ferroelectr...
- Publication number 20050224849
- Publication date Oct 13, 2005
- Mark S. Isenberger
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated circuit package with reduced stress on die and associate...
- Publication number 20040188813
- Publication date Sep 30, 2004
- Intel Corporation
- Sairam Agraharam
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Carlton E. Hanna

Person

Patents Grantslast 30 patents

Module installation on printed circuit boards with embedded trace t...

Partially molded direct chip attach package structures for connecti...

Integrated antenna for direct chip attach connectivity module packa...

Partially molded direct chip attach package structures for connecti...

Ultra slim RF package for ultrabooks and smart phones

C4 joint reliability

C4 joint reliability

Integrated circuit packages with reduced stress on die and associat...

Metal heater for in situ heating and crystallization of ferroelectr...

Integrated circuit packages with reduced stress on die and associat...

Patents Applicationslast 30 patents

CHIP-FIRST LAYERED PACKAGING ARCHITECTURE

INTERPOSERS FOR SEMICONDUCTOR DEVICES

THIN CLIENT FORM FACTOR ASSEMBLY

GLASS CORE SUBSTRATE PRINTED CIRCUIT BOARD FOR WARPAGE REDUCTION

GLASS BRIDGE FOR CONNECTING DIES

SUBSTRATE FOR IMPROVED HEAT DISSIPATION AND METHOD

MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS

MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS

MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

MODULE INSTALLATION ON PRINTED CIRCUIT BOARDS WITH EMBEDDED TRACE T...

PARTIALLY MOLDED DIRECT CHIP ATTACH PACKAGE STRUCTURES FOR CONNECTI...

SHIELDING SOLUTIONS FOR DIRECT CHIP ATTACH CONNECTIVITY MODULE PACK...

INTEGRATED ANTENNA FOR DIRECT CHIP ATTACH CONNECTIVITY MODULE PACKA...

ULTRA SLIM RF PACKAGE FOR ULTRABOOKS AND SMART PHONES

C4 JOINT RELIABILITY

C4 joint reliability

Integrated circuit packages with reduced stress on die and associat...

Metal heater for in situ heating and crystallization of ferroelectr...

Integrated circuit package with reduced stress on die and associate...