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Carolyn Block
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Portland, OR, US
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last 30 patents
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Patent Grant
Copper alloys for interconnections having improved electromigration...
Patent number
7,220,674
Issue date
May 22, 2007
Intel Corporation
Thomas N. Marieb
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper alloys for interconnections having improved electromigration...
Patent number
6,977,220
Issue date
Dec 20, 2005
Intel Corporation
Thomas N. Marieb
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper alloys for interconnections having improved electromigration...
Patent number
6,800,554
Issue date
Oct 5, 2004
Intel Corporation
Thomas N. Marieb
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Surface alteration of metal interconnect in integrated circuits for...
Patent number
6,794,755
Issue date
Sep 21, 2004
Intel Corporation
Jose A. Maiz
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
Copper alloys for interconnections having improved electromigration...
Publication number
20040224507
Publication date
Nov 11, 2004
Thomas N. Marieb
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Copper alloys for interconnections having improved electromigration...
Publication number
20040219788
Publication date
Nov 4, 2004
Thomas N. Marieb
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
A METHOD OF FORMING SURFACE ALTERATION OF METAL INTERCONNECT IN INT...
Publication number
20040056366
Publication date
Mar 25, 2004
Jose A. Maiz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Surface alteration of metal interconnect in integrated circuits for...
Publication number
20040056329
Publication date
Mar 25, 2004
Jose A. Maiz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Copper alloys for interconnections having improved electromigration...
Publication number
20020076925
Publication date
Jun 20, 2002
Thomas N. Marieb
H01 - BASIC ELECTRIC ELEMENTS