Membership
Tour
Register
Log in
Carsten Bender
Follow
Person
Muenchen, DE
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Substrate for producing a soldering connection
Patent number
7,271,484
Issue date
Sep 18, 2007
Infineon Technologies AG
Martin Reiss
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Method for producing an FBGA component and substrate for carrying o...
Publication number
20060180921
Publication date
Aug 17, 2006
Steffen Kroehnert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Substrate-based die package with BGA or BGA-like components
Publication number
20050285247
Publication date
Dec 29, 2005
Martin Reiss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Arrangement for increasing the reliability of substrate-based BGA p...
Publication number
20050285266
Publication date
Dec 29, 2005
Martin Reiss
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Arrangement of a chip package constructed on a substrate and substr...
Publication number
20050121807
Publication date
Jun 9, 2005
Martin Reiss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Substrate for producing a soldering connection
Publication number
20050098611
Publication date
May 12, 2005
Martin Reiss
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Arrangement for improving module reliability
Publication number
20050051896
Publication date
Mar 10, 2005
Martin Reiss
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR