Carsten Ehlers

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Monchengladbach, DE

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Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor device and method for fabricating a power semic...
- Patent number 11,652,028
- Issue date May 16, 2023
- Infineon Technologies AG
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Power Semiconductor Module Comprising a First and a Second Compartm...
- Publication number 20240071853
- Publication date Feb 29, 2024
- INFINEON TECHNOLOGIES AG
- Hans Hartung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE
- Publication number 20230360982
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Martin Goldammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND FOOT SEALING FOR CHIP FRONTSIDE METALLIZATION
- Publication number 20220392818
- Publication date Dec 8, 2022
- INFINEON TECHNOLOGIES AG
- Carsten Ehlers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A POWER SEMIC...
- Publication number 20210242111
- Publication date Aug 5, 2021
- INFINEON TECHNOLOGIES AG
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS