Casey F. Kane

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Linden, NJ, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of making semiconductor devices by patterning a wafer having...
- Patent number 5,907,791
- Issue date May 25, 1999
- Lucent Technologies Inc.
- Mark Anthony Cappuzzo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of solder bonding
- Patent number 5,620,131
- Issue date Apr 15, 1997
- Lucent Technologies Inc.
- Casey F. Kane
- H01 - BASIC ELECTRIC ELEMENTS