Casey Prindiville

Person

Nampa, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Internal package heat dissipator
- Patent number 7,163,845
- Issue date Jan 16, 2007
- Micron Technology, Inc.
- Casey L. Prindiville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internal package heat dissipator
- Patent number 6,949,824
- Issue date Sep 27, 2005
- Micron Technology, Inc.
- Casey L. Prindiville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for making the same
- Patent number 6,891,108
- Issue date May 10, 2005
- Micron Technology, Inc.
- Casey Prindiville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for making the same
- Patent number 6,858,927
- Issue date Feb 22, 2005
- Micron Technology, Inc.
- Casey Prindiville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for making the same
- Patent number 6,833,510
- Issue date Dec 21, 2004
- Micron Technology, Inc.
- Casey Prindiville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for gate blocking X-outs during a molding process
- Patent number 6,791,198
- Issue date Sep 14, 2004
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for making the same
- Patent number 6,779,258
- Issue date Aug 24, 2004
- Micron Technology, Inc.
- Casey Prindiville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for gate blocking X-outs during a molding process
- Patent number 6,776,599
- Issue date Aug 17, 2004
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for coverlay removal and adhesive application
- Patent number 6,749,711
- Issue date Jun 15, 2004
- Micron Technology, Inc.
- Casey Prindiville
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Semiconductor packages and methods for making the same
- Patent number 6,548,764
- Issue date Apr 15, 2003
- Micron Technology, Inc.
- Casey Prindiville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for coverlay removal and adhesive application
- Patent number 6,543,510
- Issue date Apr 8, 2003
- Micron Technology, Inc.
- Casey Prindiville
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method for gate blocking x-outs during a molding process
- Patent number 6,523,254
- Issue date Feb 25, 2003
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Internal package heat dissipator
- Publication number 20050275087
- Publication date Dec 15, 2005
- Micron Technology, Inc.
- Casey L. Prindiville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Internal package heat dissipator
- Publication number 20050269675
- Publication date Dec 8, 2005
- Micron Technology, Inc.
- Casey L. Prindiville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and methods for coverlay removal and adhesive application
- Publication number 20050034818
- Publication date Feb 17, 2005
- Micron Technology, Inc.
- Casey Prindiville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and methods for coverlay removal and adhesive application
- Publication number 20030127182
- Publication date Jul 10, 2003
- Micron Technology, Inc.
- Casey Prindiville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for gate blocking X-outs during a molding process
- Publication number 20030100141
- Publication date May 29, 2003
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for gate blocking X-outs during a molding process
- Publication number 20030088976
- Publication date May 15, 2003
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for gate blocking X-outs during a molding process
- Publication number 20030088977
- Publication date May 15, 2003
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packages and methods for making the same
- Publication number 20020043401
- Publication date Apr 18, 2002
- Micron Technology, Inc.
- Casey Prindiville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packages and methods for making the same
- Publication number 20020030575
- Publication date Mar 14, 2002
- Micron Technology, Inc.
- Casey Prindiville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packages and methods for making the same
- Publication number 20020020902
- Publication date Feb 21, 2002
- Micron Technology, Inc.
- Casey Prindiville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packages and methods for making the same
- Publication number 20020020908
- Publication date Feb 21, 2002
- Micron Technology, Inc.
- Casey Prindiville
- H01 - BASIC ELECTRIC ELEMENTS

Casey Prindiville

Person

Patents Grantslast 30 patents

Internal package heat dissipator

Internal package heat dissipator

Semiconductor packages and methods for making the same

Semiconductor packages and methods for making the same

Semiconductor packages and methods for making the same

Method and apparatus for gate blocking X-outs during a molding process

Semiconductor packages and methods for making the same

Method and apparatus for gate blocking X-outs during a molding process

Apparatus and methods for coverlay removal and adhesive application

Semiconductor packages and methods for making the same

Apparatus and methods for coverlay removal and adhesive application

Method for gate blocking x-outs during a molding process

Patents Applicationslast 30 patents

Internal package heat dissipator

Internal package heat dissipator

Apparatus and methods for coverlay removal and adhesive application

Apparatus and methods for coverlay removal and adhesive application

Method and apparatus for gate blocking X-outs during a molding process

Method and apparatus for gate blocking X-outs during a molding process

Method and apparatus for gate blocking X-outs during a molding process

Semiconductor packages and methods for making the same

Semiconductor packages and methods for making the same

Semiconductor packages and methods for making the same

Semiconductor packages and methods for making the same