Catherine Dufort

Person

Bromont, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Direct bonded heterogeneous integration silicon bridge
- Patent number 11,791,270
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Kamal K Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure with controlled capillary coverage
- Patent number 11,152,226
- Issue date Oct 19, 2021
- International Business Machines Corporation
- Kevin Drummond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer molding of integrated circuit packages
- Patent number 6,988,882
- Issue date Jan 24, 2006
- International Business Machines Corporation
- Marie-France Boyaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer molding of integrated circuit packages
- Patent number 6,956,296
- Issue date Oct 18, 2005
- International Business Machines Corporation
- Marie-France Boyaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer molding of integrated circuit packages
- Patent number 6,656,773
- Issue date Dec 2, 2003
- International Business Machines Corporation
- Marie-France Boyaud
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION SILICON BRIDGE
- Publication number 20220359401
- Publication date Nov 10, 2022
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH CONTROLLED CAPILLARY COVERAGE
- Publication number 20210111039
- Publication date Apr 15, 2021
- International Business Machines Corporation
- Kevin Drummond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING DENSITY OF PARTICLES WITHIN UNDERFILL SURROUNDING SOLDE...
- Publication number 20130161822
- Publication date Jun 27, 2013
- International Business Machines Corporation
- Stephane S. Barbeau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING DENSITY OF PARTICLES WITHIN UNDERFILL SURROUNDING SOLDE...
- Publication number 20120168956
- Publication date Jul 5, 2012
- International Business Machines Corporation
- Stephane S. Barbeau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer molding of integrated circuit packages
- Publication number 20050275091
- Publication date Dec 15, 2005
- International Business Machines Corporation
- Marie-France Boyaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer holding of integrated circuit packages
- Publication number 20040071805
- Publication date Apr 15, 2004
- International Business Machines Corporation
- Marie-France Boyaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer molding of integrated circuit packages
- Publication number 20020192876
- Publication date Dec 19, 2002
- Marie-France Boyaud
- H01 - BASIC ELECTRIC ELEMENTS

Catherine Dufort

Person

Patents Grantslast 30 patents

Direct bonded heterogeneous integration silicon bridge

Structure with controlled capillary coverage

Transfer molding of integrated circuit packages

Transfer molding of integrated circuit packages

Transfer molding of integrated circuit packages

Patents Applicationslast 30 patents

DIRECT BONDED HETEROGENEOUS INTEGRATION SILICON BRIDGE

STRUCTURE WITH CONTROLLED CAPILLARY COVERAGE

CONTROLLING DENSITY OF PARTICLES WITHIN UNDERFILL SURROUNDING SOLDE...

CONTROLLING DENSITY OF PARTICLES WITHIN UNDERFILL SURROUNDING SOLDE...

Transfer molding of integrated circuit packages

Transfer holding of integrated circuit packages

Transfer molding of integrated circuit packages