Ce Qin

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor mask reshaping using a sacrificial layer
- Patent number 12,165,878
- Issue date Dec 10, 2024
- Lam Research Corporation
- Zhongkui Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon oxide silicon nitride stack stair step etch
- Patent number 11,646,207
- Issue date May 9, 2023
- Lam Research Corporation
- Ce Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amorphous carbon layer opening process
- Patent number 11,037,784
- Issue date Jun 15, 2021
- Lam Research Corporation
- Ce Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid stair-step etch
- Patent number 9,741,563
- Issue date Aug 22, 2017
- Lam Research Corporation
- Hua Xiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming stair-step structures
- Patent number RE46464
- Issue date Jul 4, 2017
- Lam Research Corporation
- Qian Fu
Information Patent Grant
Method for forming stair-step structures
- Patent number 8,535,549
- Issue date Sep 17, 2013
- Lam Research Corporation
- Qian Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-workpiece processing chamber
- Patent number 8,066,815
- Issue date Nov 29, 2011
- Mattson Technology, Inc.
- Daniel J. Devine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-workpiece processing chamber
- Patent number 7,276,122
- Issue date Oct 2, 2007
- Mattson Technology, Inc.
- Daniel J. Devine
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MASK RESHAPING USING A SACRIFICIAL LAYER
- Publication number 20220076962
- Publication date Mar 10, 2022
- LAM RESEARCH CORPORATION
- Zhongkui Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON OXIDE SILICON NITRIDE STACK STAIR STEP ETCH
- Publication number 20210407811
- Publication date Dec 30, 2021
- LAM RESEARCH CORPORATION
- Ce QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMORPHOUS CARBON LAYER OPENING PROCESS
- Publication number 20210035796
- Publication date Feb 4, 2021
- LAM RESEARCH CORPORATION
- Ce QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID STAIR-STEP ETCH
- Publication number 20170213723
- Publication date Jul 27, 2017
- LAM RESEARCH CORPORATION
- Hua XIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING STAIR-STEP STRUCTURES
- Publication number 20120149203
- Publication date Jun 14, 2012
- LAM RESEARCH CORPORATION
- Qian Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Process Performance Matching in Mul...
- Publication number 20090206056
- Publication date Aug 20, 2009
- Songlin Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective etching method and apparatus
- Publication number 20080124937
- Publication date May 29, 2008
- Songlin Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-workpiece processing chamber
- Publication number 20050247265
- Publication date Nov 10, 2005
- Daniel J. Devine
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor mask reshaping using a sacrificial layer

Silicon oxide silicon nitride stack stair step etch

Amorphous carbon layer opening process

Hybrid stair-step etch

Method for forming stair-step structures

Method for forming stair-step structures

Multi-workpiece processing chamber

Multi-workpiece processing chamber

Patents Applicationslast 30 patents

SEMICONDUCTOR MASK RESHAPING USING A SACRIFICIAL LAYER

SILICON OXIDE SILICON NITRIDE STACK STAIR STEP ETCH

AMORPHOUS CARBON LAYER OPENING PROCESS

HYBRID STAIR-STEP ETCH

METHOD FOR FORMING STAIR-STEP STRUCTURES

Method and Apparatus for Plasma Process Performance Matching in Mul...

Selective etching method and apparatus

Multi-workpiece processing chamber