Cecile Berne

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Grenoble, FR

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Patents Grantslast 30 patents

Information Patent Grant
Substrate layer cutting device and method
- Patent number 7,406,994
- Issue date Aug 5, 2008
- S.O.I. Tec Silicon on Insulator Technologies
- Muriel Martinez
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Substrate layer cutting device and method
- Patent number 7,189,304
- Issue date Mar 13, 2007
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Muriel Martinez
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Two-stage annealing method for manufacturing semiconductor substrates
- Patent number 6,936,523
- Issue date Aug 30, 2005
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Cecile Berne
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE LAYER CUTTING DEVICE AND METHOD
- Publication number 20070122926
- Publication date May 31, 2007
- S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES S.A.
- Muriel Martinez
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Two-stage annealing method for manufacturing semiconductor substrates
- Publication number 20040161904
- Publication date Aug 19, 2004
- SOITEC & CEA
- Cecile Berne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate layer cutting device and method
- Publication number 20040144487
- Publication date Jul 29, 2004
- Muriel Martinez
- B28 - WORKING CEMENT, CLAY, OR STONE