CH CHEW

Follow

Person

Seremban, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Molded semiconductor package and related methods
- Patent number 11,791,297
- Issue date Oct 17, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Sw Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package and related methods
- Patent number 11,244,918
- Issue date Feb 8, 2022
- Semiconductor Components Industries, LLC
- Sw Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor package and related methods
- Patent number 10,319,639
- Issue date Jun 11, 2019
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20240006363
- Publication date Jan 4, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Sw WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20220157756
- Publication date May 19, 2022
- Semiconductor Components Industries, LLC
- Sw WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190115275
- Publication date Apr 18, 2019
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190057947
- Publication date Feb 21, 2019
- Semiconductor Components Industries, LLC
- Sw WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190057900
- Publication date Feb 21, 2019
- Semiconductor Components Industries, LLC
- Shutesh KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS