Cha-Hsin Lin

Person

Hsinchu Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,368,475
- Issue date Jun 14, 2016
- Industrial Technology Research Institute
- Shang-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,257,337
- Issue date Feb 9, 2016
- Industrial Technology Research Institute
- Shang-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing through substrate via (TSV), structure and...
- Patent number 9,257,322
- Issue date Feb 9, 2016
- Industrial Technology Research Institute
- Erh-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV substrate structure and the stacked assembly thereof
- Patent number 9,257,338
- Issue date Feb 9, 2016
- Industrial Technology Research Institute
- Chung-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,093,312
- Issue date Jul 28, 2015
- Industrial Technology Research Institute
- Shang-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,041,163
- Issue date May 26, 2015
- Industrial Technology Research Institute
- Shang-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with conductive plug in an oxide layer
- Patent number 8,445,995
- Issue date May 21, 2013
- Industrial Technology Research Institute
- Cha-Hsin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating oxide material layer with openings attached t...
- Patent number 8,309,402
- Issue date Nov 13, 2012
- Industrial Technology Research Institute
- Cha-Hsin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bridging random access memory device and method of manuf...
- Patent number 8,124,954
- Issue date Feb 28, 2012
- Industrial Technology Research Institute
- Ching-Chiun Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bottom electrode of metal-insulator-metal capacitor
- Patent number 7,880,213
- Issue date Feb 1, 2011
- Industrial Technology Research Institute
- Wen-Miao Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrolyte transistor
- Patent number 7,724,499
- Issue date May 25, 2010
- Industrial Technology Research Institute
- Cha-Hsin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor
- Patent number 7,700,988
- Issue date Apr 20, 2010
- Industrail Technology Research Institute
- Cha-Hsin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state electrolyte memory device and method of fabricating the...
- Patent number 7,696,509
- Issue date Apr 13, 2010
- Industrial Technology Research Institute
- Cha-Hsin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon based photodetector
- Patent number 7,683,374
- Issue date Mar 23, 2010
- Industrial Technology Research Institute
- Cha-Hsin Lin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Non-volatile memory device and fabricating method thereof
- Patent number 7,663,177
- Issue date Feb 16, 2010
- Industrial Technology Research Institute
- Cha-Hsin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,589,373
- Issue date Sep 15, 2009
- Industrial Technology Research Institute
- Cha-Hsin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 7,521,305
- Issue date Apr 21, 2009
- Industrial Technology Research Institute
- Cha-Hsin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating metal compound dots dielectric piece
- Patent number 7,507,653
- Issue date Mar 24, 2009
- Industrial Technology Research Institute
- Cha-Hsin Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sensing memory device
- Patent number 7,498,631
- Issue date Mar 3, 2009
- Industrial Technology Research Institute
- Cha-Hsin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultraviolet detector
- Patent number 7,408,170
- Issue date Aug 5, 2008
- Industrial Technology Research Institute
- Cha-Hsin Lin
- G01 - MEASURING TESTING
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 7,371,628
- Issue date May 13, 2008
- Industrial Technology Research Institute
- Cha-Hsin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor devices
- Patent number 7,347,228
- Issue date Mar 25, 2008
- Industrial Technology Research Institute
- Cha-Hsin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor devices
- Patent number 7,033,899
- Issue date Apr 25, 2006
- Industrial Technology Research Institute
- Cha-Hsin Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20150294953
- Publication date Oct 15, 2015
- Industrial Technology Research Institute
- Shang-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV SUBSTRATE STRUCTURE AND THE STACKED ASSEMBLY THEREOF
- Publication number 20150155204
- Publication date Jun 4, 2015
- Industrial Technology Research Institute
- Chung-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20150104927
- Publication date Apr 16, 2015
- Industrial Technology Research Institute
- Shang-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140346666
- Publication date Nov 27, 2014
- Industrial Technology Research Institute
- Shang-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20140312468
- Publication date Oct 23, 2014
- Industrial Technology Research Institute
- Shang-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FLATTENING SURFACE OF CONDUCTIVE STRUCTURE AND CONDUCTIVE...
- Publication number 20140238725
- Publication date Aug 28, 2014
- Industrial Technology Research Institute
- Erh-Hao Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20140175655
- Publication date Jun 26, 2014
- Jui-Chin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACKING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140175614
- Publication date Jun 26, 2014
- Industrial Technology Research Institute
- CHUNG-CHIH WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING THROUGH SUBSTRATE VIA (TSV), STRUCTURE AND...
- Publication number 20140008800
- Publication date Jan 9, 2014
- Industrial Technology Research Institute
- Erh-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE
- Publication number 20140008652
- Publication date Jan 9, 2014
- Industrial Technology Research Institute
- TZU-CHIEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL DAMASCENE STRUCTURE HAVING THROUGH SILICON VIA AND MANUFACTURI...
- Publication number 20130270713
- Publication date Oct 17, 2013
- Industrial Technology Research Institute
- Sue-Chen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV SUBSTRATE STRUCTURE AND THE STACKED ASSEMBLY THEREOF
- Publication number 20130214390
- Publication date Aug 22, 2013
- Industrial Technology Research Institute
- Chung-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20130161825
- Publication date Jun 27, 2013
- Industrial Technology Research Institute
- TZU-CHIEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20120322249
- Publication date Dec 20, 2012
- Industrial Technology Research Institute
- Jui-Chin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120139105
- Publication date Jun 7, 2012
- Industrial Technology Research Institute
- Cha-Hsin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20120142184
- Publication date Jun 7, 2012
- Industrial Technology Research Institute
- Cha-Hsin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV SUBSTRATE STRUCTURE AND THE STACKED ASSEMBLY THEREOF
- Publication number 20120133030
- Publication date May 31, 2012
- Industrial Technology Research Institute
- Chung-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CAPACITOR STRUCTURES AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120127625
- Publication date May 24, 2012
- Industrial Technology Research Institute
- Chung-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120119375
- Publication date May 17, 2012
- Industrial Technology Research Institute
- Jui-Chin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING THROUGH-SILICON-VIA AND THROUGH-SILICON-VIA...
- Publication number 20100164062
- Publication date Jul 1, 2010
- Industrial Technology Research Institute
- Ching-Chiun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BRIDGING RANDOM ACCESS MEMORY DEVICE AND METHOD OF MANUF...
- Publication number 20100163829
- Publication date Jul 1, 2010
- Industrial Technology Research Institute
- Ching-Chiun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTE TRANSISTOR AND METHOD OF FABRICATING THE SAME
- Publication number 20090122465
- Publication date May 14, 2009
- Industrial Technology Research Institute
- Cha-Hsin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL COMPOUND DOTS DIELECTRIC PIECE
- Publication number 20090124483
- Publication date May 14, 2009
- Industrial Technology Research Institute
- Cha-Hsin Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090114975
- Publication date May 7, 2009
- Industrial Technology Research Institute
- Cha-Hsin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE ELECTROLYTE MEMORY DEVICE AND METHOD OF FABRICATING THE...
- Publication number 20090026438
- Publication date Jan 29, 2009
- Industrial Technology Research Institute
- Cha-Hsin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING MEMORY DEVICE
- Publication number 20080121968
- Publication date May 29, 2008
- Cha-Hsin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING METAL COMPOUND DOTS DIELECTRIC PIECE
- Publication number 20080095931
- Publication date Apr 24, 2008
- Industrial Technology Research Institute
- Cha-Hsin Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RESISTANCE TYPE MEMORY DEVICE
- Publication number 20080054394
- Publication date Mar 6, 2008
- Industrial Technology Research Institute
- Cha-Hsin Lin
- G11 - INFORMATION STORAGE
Information Patent Application
PHOTO SENSOR AND FABRICATION METHOD THEREOF
- Publication number 20080023782
- Publication date Jan 31, 2008
- Industrial Technology Research Institute
- Cha-Hsin LIN
- G02 - OPTICS
Information Patent Application
MEMORY STRUCTURE AND DATA WRITING METHOD THEREOF
- Publication number 20080019168
- Publication date Jan 24, 2008
- Cha-Hsin Lin
- G11 - INFORMATION STORAGE

Cha-Hsin Lin

Person

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Method for manufacturing through substrate via (TSV), structure and...

TSV substrate structure and the stacked assembly thereof

Semiconductor device and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Semiconductor structure with conductive plug in an oxide layer

Method of fabricating oxide material layer with openings attached t...

Conductive bridging random access memory device and method of manuf...

Bottom electrode of metal-insulator-metal capacitor

Electrolyte transistor

Metal-insulator-metal capacitor

Solid state electrolyte memory device and method of fabricating the...

Silicon based photodetector

Non-volatile memory device and fabricating method thereof

Semiconductor device

Method for fabricating semiconductor device

Method of fabricating metal compound dots dielectric piece

Sensing memory device

Ultraviolet detector

Method for fabricating semiconductor device

Method of making semiconductor devices

Method of making semiconductor devices

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

TSV SUBSTRATE STRUCTURE AND THE STACKED ASSEMBLY THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF FLATTENING SURFACE OF CONDUCTIVE STRUCTURE AND CONDUCTIVE...

CHIP BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

WAFER STACKING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING THROUGH SUBSTRATE VIA (TSV), STRUCTURE AND...

THROUGH-SUBSTRATE VIA STRUCTURE

DUAL DAMASCENE STRUCTURE HAVING THROUGH SILICON VIA AND MANUFACTURI...

TSV SUBSTRATE STRUCTURE AND THE STACKED ASSEMBLY THEREOF

THROUGH SUBSTRATE VIA STRUCTURE AND METHOD FOR FABRICATING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

TSV SUBSTRATE STRUCTURE AND THE STACKED ASSEMBLY THEREOF

TRENCH CAPACITOR STRUCTURES AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING THROUGH-SILICON-VIA AND THROUGH-SILICON-VIA...

CONDUCTIVE BRIDGING RANDOM ACCESS MEMORY DEVICE AND METHOD OF MANUF...

ELECTROLYTE TRANSISTOR AND METHOD OF FABRICATING THE SAME

METAL COMPOUND DOTS DIELECTRIC PIECE

SEMICONDUCTOR DEVICE

SOLID STATE ELECTROLYTE MEMORY DEVICE AND METHOD OF FABRICATING THE...

SENSING MEMORY DEVICE

METHOD OF FABRICATING METAL COMPOUND DOTS DIELECTRIC PIECE

RESISTANCE TYPE MEMORY DEVICE

PHOTO SENSOR AND FABRICATION METHOD THEREOF

MEMORY STRUCTURE AND DATA WRITING METHOD THEREOF