Cha-jea JO

Person

Yongin-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Image sensor package
- Patent number 12,113,087
- Issue date Oct 8, 2024
- Samsung Electronics Co., Ltd.
- Ji-hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package
- Patent number 11,637,140
- Issue date Apr 25, 2023
- Samsung Electronics Co., Ltd.
- Ji-hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,610,865
- Issue date Mar 21, 2023
- Samsung Electronics Co., Ltd.
- Sun-kyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and apparatus comprising the same
- Patent number 11,244,936
- Issue date Feb 8, 2022
- Samsung Electronics Co., Ltd.
- Yun Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, semiconductor package, and method of fabricating interp...
- Patent number 11,018,026
- Issue date May 25, 2021
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor package
- Patent number 10,991,677
- Issue date Apr 27, 2021
- Samsung Electronics Co., Ltd.
- Sun-kyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package
- Patent number 10,971,535
- Issue date Apr 6, 2021
- Samsung Electronics Co., Ltd.
- Ji-hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,867,970
- Issue date Dec 15, 2020
- Samsung Electronics Co., Ltd.
- Sun-kyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structures for image sensor modules and image sensor modu...
- Patent number 10,750,112
- Issue date Aug 18, 2020
- Samsung Electronics Co., Ltd.
- Ji-Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and image sensor
- Patent number 10,680,025
- Issue date Jun 9, 2020
- Samsung Electronics Co., Ltd.
- Jong Bo Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,658,341
- Issue date May 19, 2020
- Samsung Electronics Co., Ltd.
- Sun-kyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an interposer
- Patent number 10,535,534
- Issue date Jan 14, 2020
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for stacking semiconductor chips in a semiconductor package
- Patent number 10,483,150
- Issue date Nov 19, 2019
- Samsung Electronics Co., Ltd.
- Gun-Ah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,373,935
- Issue date Aug 6, 2019
- Samsung Electronics Co., Ltd.
- Sun-kyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a rewiring layer with an embedded chip
- Patent number 10,224,272
- Issue date Mar 5, 2019
- Samsung Electronics Co., Ltd.
- Ji-Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor packages
- Patent number 10,141,286
- Issue date Nov 27, 2018
- Samsung Electronics Co., Ltd.
- Won-Il Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, semiconductor package including the same, and m...
- Patent number 10,134,702
- Issue date Nov 20, 2018
- Samsung Electronics Co., Ltd.
- Sun-kyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,083,939
- Issue date Sep 25, 2018
- Samsung Electronics Co., Ltd.
- Sun-kyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 10,026,724
- Issue date Jul 17, 2018
- Samsung Electronics Co., Ltd.
- Ji-hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a rewiring layer with an embedded chip
- Patent number 9,997,446
- Issue date Jun 12, 2018
- Samsung Electronics Co., Ltd.
- Ji-Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 9,966,364
- Issue date May 8, 2018
- Samsung Electronics Co., Ltd.
- Gun Ho Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a packaged integrated circuit with through-si...
- Patent number 9,728,424
- Issue date Aug 8, 2017
- Samsung Electronics Co., Ltd.
- Ji-hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, semiconductor package including the same, and m...
- Patent number 9,666,551
- Issue date May 30, 2017
- Smasung Electronics Co., Ltd.
- Sun-kyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated circuit
- Patent number 9,618,716
- Issue date Apr 11, 2017
- Samsung Electronics Co., Ltd.
- Sang-Cheon Park
- G02 - OPTICS
Information Patent Grant
Semiconductor package having stacked semiconductor chips
- Patent number 9,589,945
- Issue date Mar 7, 2017
- Samsung Electronics Co., Ltd.
- Cha-jea Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package
- Patent number 9,543,231
- Issue date Jan 10, 2017
- Samsung Electronics Co., Ltd.
- Yun-seok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 9,159,659
- Issue date Oct 13, 2015
- Samsung Electronics Co., Ltd.
- Sang-Won Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor multi-chip stack packages
- Patent number 8,980,689
- Issue date Mar 17, 2015
- Samsung Electronics Co., Ltd.
- Byoung-Soo Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device including a substrate at...
- Patent number 8,912,048
- Issue date Dec 16, 2014
- Samsung Electronics Co., Ltd.
- Jong-Youn Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package
- Patent number 8,723,315
- Issue date May 13, 2014
- Samsung Electronics Co., Ltd.
- Jong-Joo Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240162181
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sun Jae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE
- Publication number 20230238417
- Publication date Jul 27, 2023
- Samsung Electronics Co., Ltd.
- Ji-hwang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210217735
- Publication date Jul 15, 2021
- Samsung Electronics Co., Ltd.
- Sun-kyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE
- Publication number 20210202563
- Publication date Jul 1, 2021
- Samsung Electronics Co., Ltd.
- Ji-hwang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200286862
- Publication date Sep 10, 2020
- Samsung Electronics Co., Ltd.
- Sun-kyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200243488
- Publication date Jul 30, 2020
- Samsung Electronics Co., Ltd.
- Sun-kyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICATING INTERP...
- Publication number 20200144076
- Publication date May 7, 2020
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190312013
- Publication date Oct 10, 2019
- Samsung Electronics Co., Ltd.
- Sun-kyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND APPARATUS COMPRISING THE SAME
- Publication number 20190295998
- Publication date Sep 26, 2019
- Samsung Electronics Co., Ltd.
- Yun Hyeok IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURES FOR IMAGE SENSOR MODULES AND IMAGE SENSOR MODU...
- Publication number 20190174087
- Publication date Jun 6, 2019
- Samsung Electronics Co., Ltd.
- Ji-Hwang KIM
- G02 - OPTICS
Information Patent Application
Semiconductor Package and Image Sensor
- Publication number 20190103432
- Publication date Apr 4, 2019
- Samsung Electronics Co., Ltd.
- Jong Bo Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20180374825
- Publication date Dec 27, 2018
- Samsung Electronics Co., Ltd.
- Sun-kyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180315740
- Publication date Nov 1, 2018
- Samsung Electronics Co., Ltd.
- Yun Hyeok IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A REWIRING LAYER WITH AN EMBEDDED CHIP
- Publication number 20180294216
- Publication date Oct 11, 2018
- Samsung Electronics Co., Ltd.
- JI-HWANG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE
- Publication number 20180145104
- Publication date May 24, 2018
- Samsung Electronics Co., Ltd.
- Ji-hwang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20180061812
- Publication date Mar 1, 2018
- Samsung Electronics Co., Ltd.
- WON-IL LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A REWIRING LAYER WITH AN EMBEDDED CHIP
- Publication number 20180040548
- Publication date Feb 8, 2018
- JI-HWANG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180040590
- Publication date Feb 8, 2018
- Samsung Electronics Co., Ltd.
- Gun Ho CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180006006
- Publication date Jan 4, 2018
- Samsung Electronics Co., Ltd.
- Ji-hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20170338206
- Publication date Nov 23, 2017
- Samsung Electronics Co., Ltd.
- Sun-kyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICATING INTERP...
- Publication number 20170330767
- Publication date Nov 16, 2017
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
APPARATUS FOR STACKING SEMICONDUCTOR CHIPS IN A SEMICONDUCTOR PACKAGE
- Publication number 20170236798
- Publication date Aug 17, 2017
- Samsung Electronics Co., Ltd.
- GUN-AH LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND M...
- Publication number 20170229412
- Publication date Aug 10, 2017
- Samsung Electronics Co., Ltd.
- Sun-kyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND M...
- Publication number 20170170136
- Publication date Jun 15, 2017
- Samsung Electronics Co., Ltd.
- Sun-kyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170047310
- Publication date Feb 16, 2017
- Samsung Electronics Co., Ltd.
- Jong-Bo SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT
- Publication number 20160266341
- Publication date Sep 15, 2016
- Samsung Electronics Co., Ltd.
- Sang-Cheon PARK
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160225721
- Publication date Aug 4, 2016
- Samsung Electronics Co., Ltd.
- EUN-KYOUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS
- Publication number 20160093598
- Publication date Mar 31, 2016
- Cha-jea JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160013091
- Publication date Jan 14, 2016
- Samsung Electronics Co., Ltd.
- Ji-hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE
- Publication number 20150200154
- Publication date Jul 16, 2015
- Yun-seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Image sensor package

Image sensor package

Semiconductor package

Semiconductor device package and apparatus comprising the same

Interposer, semiconductor package, and method of fabricating interp...

Semiconductor package

Image sensor package

Semiconductor package

Substrate structures for image sensor modules and image sensor modu...

Semiconductor package and image sensor

Semiconductor package

Method of fabricating an interposer

Apparatus for stacking semiconductor chips in a semiconductor package

Semiconductor package

Semiconductor package including a rewiring layer with an embedded chip

Methods of manufacturing semiconductor packages

Semiconductor chip, semiconductor package including the same, and m...

Semiconductor package

Semiconductor package and method of manufacturing the same

Semiconductor package including a rewiring layer with an embedded chip

Semiconductor package and method for fabricating the same

Method of fabricating a packaged integrated circuit with through-si...

Semiconductor chip, semiconductor package including the same, and m...

Photonic integrated circuit

Semiconductor package having stacked semiconductor chips

Stacked semiconductor package

Semiconductor package and method of manufacturing the semiconductor...

Method of fabricating semiconductor multi-chip stack packages

Method of fabricating semiconductor device including a substrate at...

Flip chip package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES

IMAGE SENSOR PACKAGE

SEMICONDUCTOR PACKAGE

IMAGE SENSOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

INTERPOSER, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICATING INTERP...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND APPARATUS COMPRISING THE SAME

SUBSTRATE STRUCTURES FOR IMAGE SENSOR MODULES AND IMAGE SENSOR MODU...

Semiconductor Package and Image Sensor

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING A REWIRING LAYER WITH AN EMBEDDED CHIP

IMAGE SENSOR PACKAGE

METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE INCLUDING A REWIRING LAYER WITH AN EMBEDDED CHIP

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

INTERPOSER, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICATING INTERP...

APPARATUS FOR STACKING SEMICONDUCTOR CHIPS IN A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND M...

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND M...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PHOTONIC INTEGRATED CIRCUIT

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

STACKED SEMICONDUCTOR PACKAGE