Chadi Farid Theodossy

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Rocklin, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Housing air vent for electronic equipment
- Patent number 10,418,754
- Issue date Sep 17, 2019
- Hewlett Packard Enterprise Development LP
- James D. Hensley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-function module for insertion into a networking chassis slot
- Patent number 9,161,475
- Issue date Oct 13, 2015
- Hewlett-Packard Development Company, L.P.
- Kay Seah Ng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
DIP switch configuration for increased usability with multiple cards
- Patent number 6,789,151
- Issue date Sep 7, 2004
- Hewlett-Packard Development Company, L.P.
- Anthony J Benson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Airflow flapper valve
- Patent number 6,705,833
- Issue date Mar 16, 2004
- Hewlett-Packard Development Company, L.P.
- Victoria Tsang Tam
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...

Patents Applicationslast 30 patents

Information Patent Application
HOUSING AIR VENT FOR ELECTRONIC EQUIPMENT
- Publication number 20180358753
- Publication date Dec 13, 2018
- James D. Hensley
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MULTI-FUNCTION MODULE FOR INSERTION INTO A NETWORKING CHASSIS SLOT
- Publication number 20140118920
- Publication date May 1, 2014
- Hewlett-Packard Development Company, L.P.
- Kay Seah Ng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT SINK ASSEMBLY
- Publication number 20140036451
- Publication date Feb 6, 2014
- Glenn C. Simon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Airflow flapper valve
- Publication number 20030091433
- Publication date May 15, 2003
- Victoria Tsang Tam
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...