Chai Chee Lee

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Interconnect clip with angled contact surface and raised bridge
- Patent number 11,183,451
- Issue date Nov 23, 2021
- Infineon Technologies AG
- Chai Chee Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED PACKAGE HAVING AN ELECTRICALLY CONDUCTIVE CLIP WITH A CONVEX...
- Publication number 20240087993
- Publication date Mar 14, 2024
- Wee Aun Jason Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED PACKAGE WITH EXPOSED ELECTRICALLY CONDUCTIVE STRUCTURE...
- Publication number 20240006260
- Publication date Jan 4, 2024
- INFINEON TECHNOLOGIES AG
- Chee Hong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Clip with Angled Contact Surface and Raised Bridge Tec...
- Publication number 20210074667
- Publication date Mar 11, 2021
- Chai Chee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Clip with Angled Contact Surface and Raised Bridge
- Publication number 20210074628
- Publication date Mar 11, 2021
- Chai Chee Lee
- H01 - BASIC ELECTRIC ELEMENTS