Chai T. Chong

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Packaged semiconductor device having stress absorbing film
- Patent number 5,466,888
- Issue date Nov 14, 1995
- Hitachi, Ltd.
- Lim T. Beng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having stress absorbing film
- Patent number 5,406,028
- Issue date Apr 11, 1995
- Hitachi, Ltd.
- Lim T. Beng
- H01 - BASIC ELECTRIC ELEMENTS