Membership
Tour
Register
Log in
Chai Wei Heng
Follow
Person
Melaka, MY
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Method of fabricating a semiconductor device having a resin with wa...
Patent number
8,377,753
Issue date
Feb 19, 2013
Infineon Technologies AG
Chai Wei Heng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component and a method of fabricating an electronic comp...
Patent number
8,207,601
Issue date
Jun 26, 2012
Infinen Technologies AG
Khai Huat Jeffrey Low
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices having a resin with warpage compensated surfaces
Patent number
8,067,841
Issue date
Nov 29, 2011
Infineon Technologies AG
Chai Wei Heng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacture of encapsulated package
Patent number
7,674,657
Issue date
Mar 9, 2010
Infineon Technologies AG
Chai Wei Heng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method of Fabricating A Semiconductor Device Having A Resin With Wa...
Publication number
20120058606
Publication date
Mar 8, 2012
INFINEON TECHNOLOGIES AG
Chai Wei Heng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device
Publication number
20090212446
Publication date
Aug 27, 2009
Chai Wei Heng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Component and a Method of Fabricating an Electronic Comp...
Publication number
20090001536
Publication date
Jan 1, 2009
INFINEON TECHNOLOGIES AG
Khai Huat Jeffrey Low
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Manufacture of Encapsulated Package
Publication number
20080157433
Publication date
Jul 3, 2008
Chai Wei Heng
H01 - BASIC ELECTRIC ELEMENTS