CHAJEA JO

Person

YONGIN-SI, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 11,990,452
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,942,446
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,923,342
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Sanguk Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and semiconductor package including the same
- Patent number 11,887,913
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Chajea Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,848,293
- Issue date Dec 19, 2023
- Samsung Electronics Co., Ltd.
- Sunkyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an image sensor chip and a method o...
- Patent number 11,824,076
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Yonghoe Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,776,941
- Issue date Oct 3, 2023
- Samsung Electronics Co., Ltd.
- Yonghoe Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,626,385
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,600,608
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Jichul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,569,201
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package with underfill and image sensor module includi...
- Patent number 11,545,512
- Issue date Jan 3, 2023
- Samsung Electronics Co., Ltd.
- Chajea Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and semiconductor package including the same
- Patent number 11,545,417
- Issue date Jan 3, 2023
- Samsung Electronics Co., Ltd.
- Chajea Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,444,060
- Issue date Sep 13, 2022
- Samsung Electronics Co., Ltd.
- Sanguk Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an image sensor chip and a method o...
- Patent number 11,335,719
- Issue date May 17, 2022
- Samsung Electronics Co., Ltd.
- Yonghoe Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,158,603
- Issue date Oct 26, 2021
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a redistribution line
- Patent number 11,152,416
- Issue date Oct 19, 2021
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,985,152
- Issue date Apr 20, 2021
- Samsung Electronics Co., Ltd.
- Jichul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with connection substrate and method of manuf...
- Patent number 10,978,431
- Issue date Apr 13, 2021
- Samsung Electronics Co., Ltd.
- Jongbo Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 10,734,367
- Issue date Aug 4, 2020
- Sansumg Electronics Co., Ltd.
- Seung-Kwan Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a redistribution line
- Patent number 10,651,224
- Issue date May 12, 2020
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,510,737
- Issue date Dec 17, 2019
- Samsung Electronics Co., Ltd.
- Jichul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,361,170
- Issue date Jul 23, 2019
- Samsung Electronics Co., Ltd.
- Sungeun Pyo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and electronic device having heat dissipation...
- Patent number 10,192,855
- Issue date Jan 29, 2019
- Samsung Electronics Co., Ltd.
- Sunkyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 10,186,500
- Issue date Jan 22, 2019
- Samsung Electronics Co., Ltd.
- Seung-Kwan Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,121,731
- Issue date Nov 6, 2018
- Samsung Electronics Co., Ltd.
- Sang Cheon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having stacked chips and a heat dissipation p...
- Patent number 9,875,992
- Issue date Jan 23, 2018
- Samsung Electronics Co., Ltd.
- Junyeong Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor device including the same
- Patent number 9,679,874
- Issue date Jun 13, 2017
- Samsung Electronics Co., Ltd.
- Jin-Kwon Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for fabricating the same
- Patent number 9,461,029
- Issue date Oct 4, 2016
- Samsung Electronics Co., Ltd.
- Hye-young Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through-electrodes and methods for fab...
- Patent number 9,355,961
- Issue date May 31, 2016
- Samsung Electronics Co., Ltd.
- Chajea Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having through electrodes and methods for fa...
- Patent number 9,245,771
- Issue date Jan 26, 2016
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149479
- Publication date May 8, 2025
- SAMSUNG ELECTRONICS CO., LTD.
- Haksun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME
- Publication number 20250096047
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- YEONGSEON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DIELECTRIC LAYER WITH STEP DIFFERENCE
- Publication number 20250096208
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Jeongoh HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250022828
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429192
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- CHAJEA JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240355780
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Juhyeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240243111
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Chajea JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING THROUGH-E...
- Publication number 20240194575
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Seungryong Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240170464
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Chajea JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240162188
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Chajea JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240113057
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- JUHYEON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240088075
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Sunkyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240055406
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Yeongseon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240006272
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- Juhyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230215842
- Publication date Jul 6, 2023
- NAMHOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20230163090
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Chajea Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230138813
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Sunkyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230117072
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Chajea JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230088264
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- SANGCHEON PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN IMAGE SENSOR CHIP AND A METHOD O...
- Publication number 20220254827
- Publication date Aug 11, 2022
- Samsung Electronics Co., Ltd.
- YONGHOE CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220216186
- Publication date Jul 7, 2022
- Samsung Electronics Co., Ltd.
- Sanguk Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220122955
- Publication date Apr 21, 2022
- Samsung Electronics Co., Ltd.
- YONGHOE CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220093543
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- Sunkyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE WITH UNDERFILL AND IMAGE SENSOR MODULE INCLUDI...
- Publication number 20220045111
- Publication date Feb 10, 2022
- Samsung Electronics Co., Ltd.
- Chajea JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220045033
- Publication date Feb 10, 2022
- Samsung Electronics Co., Ltd.
- HYOEUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220013501
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Namhoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20210407890
- Publication date Dec 30, 2021
- Samsung Electronics Co., Ltd.
- Chajea JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210398929
- Publication date Dec 23, 2021
- Samsung Electronics Co., Ltd.
- HYOEUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210202462
- Publication date Jul 1, 2021
- Samsung Electronics Co., Ltd.
- JICHUL KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN IMAGE SENSOR CHIP AND A METHOD O...
- Publication number 20210028217
- Publication date Jan 28, 2021
- Samsung Electronics Co., Ltd.
- YONGHOE CHO
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package

Semiconductor package and method of manufacturing the same

Semiconductor package

Integrated circuit device and semiconductor package including the same

Semiconductor package

Semiconductor package including an image sensor chip and a method o...

Semiconductor package

Semiconductor package

Semiconductor package

Semiconductor package and method of fabricating the same

Image sensor package with underfill and image sensor module includi...

Integrated circuit device and semiconductor package including the same

Semiconductor package

Semiconductor package including an image sensor chip and a method o...

Semiconductor package and method of fabricating the same

Semiconductor package including a redistribution line

Semiconductor package

Semiconductor package with connection substrate and method of manuf...

Semiconductor package and method of fabricating the same

Semiconductor package including a redistribution line

Semiconductor package

Semiconductor package

Semiconductor package and electronic device having heat dissipation...

Semiconductor package and method of fabricating the same

Semiconductor device

Semiconductor package having stacked chips and a heat dissipation p...

Semiconductor package and semiconductor device including the same

Semiconductor packages and methods for fabricating the same

Semiconductor devices having through-electrodes and methods for fab...

Semiconductor packages having through electrodes and methods for fa...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME

SEMICONDUCTOR PACKAGE HAVING DIELECTRIC LAYER WITH STEP DIFFERENCE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING THROUGH-E...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

MEMORY DEVICE

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING AN IMAGE SENSOR CHIP AND A METHOD O...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

IMAGE SENSOR PACKAGE WITH UNDERFILL AND IMAGE SENSOR MODULE INCLUDI...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING AN IMAGE SENSOR CHIP AND A METHOD O...