Chan Chee Ling

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Negeri Sembilan, MY

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a micro-array integrated circuit package
- Patent number 7,186,588
- Issue date Mar 6, 2007
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach region for use in a micro-array integrated circuit package
- Patent number 7,064,419
- Issue date Jun 20, 2006
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS