Chan Min Yu

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged microelectronic components with terminals exposed through...
- Patent number 8,637,973
- Issue date Jan 28, 2014
- Micron Technology, Inc.
- Eng Meow Koon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for packaging circuits
- Patent number 8,138,617
- Issue date Mar 20, 2012
- Round Rock Research, LLC
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for packaging circuits
- Patent number 8,115,306
- Issue date Feb 14, 2012
- Round Rock Research, LLC
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for packaging circuits
- Patent number 7,675,169
- Issue date Mar 9, 2010
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating packaged die
- Patent number 7,358,154
- Issue date Apr 15, 2008
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support elements for semiconductor devices with peripherally locate...
- Patent number 7,285,850
- Issue date Oct 23, 2007
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor device components with peri...
- Patent number 7,226,809
- Issue date Jun 5, 2007
- Micron Technology, Inc.
- Chia Yong Poo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged microelectronic components
- Patent number 7,195,957
- Issue date Mar 27, 2007
- Micron Technology, Inc.
- Eng Meow Koon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-process semiconductor packages with leadframe grid arrays
- Patent number 7,170,161
- Issue date Jan 30, 2007
- Micron Technology, Inc.
- Chan Min Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including peripherally located bond pads, int...
- Patent number 7,115,984
- Issue date Oct 3, 2006
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making semiconductor packages with leadframe grid arrays
- Patent number 6,967,127
- Issue date Nov 22, 2005
- Micron Technology, Inc.
- Chan Min Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for packaging circuits
- Patent number 6,894,386
- Issue date May 17, 2005
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with leadframe grid arrays and components
- Patent number 6,836,008
- Issue date Dec 28, 2004
- Micron Technology, Inc.
- Chan Min Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic components
- Patent number 6,836,009
- Issue date Dec 28, 2004
- Micron Technology, Inc.
- Eng Meow Koon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor device components with peri...
- Patent number 6,818,977
- Issue date Nov 16, 2004
- Micron Technology, Inc.
- Chia Yong Poo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices including peripherally located bond pads, ass...
- Patent number 6,727,116
- Issue date Apr 27, 2004
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level stackable semiconductor package
- Patent number 6,611,052
- Issue date Aug 26, 2003
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable semiconductor package and wafer level fabrication method
- Patent number 6,582,992
- Issue date Jun 24, 2003
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package side-by-side stacking and mounting system
- Patent number 5,663,105
- Issue date Sep 2, 1997
- Texas Instruments Incorporated
- Goh Jing Sua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package side-by-side stacking and mounting system
- Patent number 5,619,067
- Issue date Apr 8, 1997
- Texas Instruments Incorporated
- Goh J. Sua
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR PACKAGING CIRCUITS
- Publication number 20100140794
- Publication date Jun 10, 2010
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC COMPONENTS
- Publication number 20080067642
- Publication date Mar 20, 2008
- Micron Technology, Inc.
- Eng Meow Koon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PACKAGING CIRCUITS
- Publication number 20080054423
- Publication date Mar 6, 2008
- Micron Technology, Inc.
- Chia Y. Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packages having leadframe-based connection arrays
- Publication number 20070120247
- Publication date May 31, 2007
- Chan Min Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices including peripherally located bond pads, int...
- Publication number 20060208351
- Publication date Sep 21, 2006
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Support elements for semiconductor devices with peripherally locate...
- Publication number 20060208350
- Publication date Sep 21, 2006
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for packaging circuits
- Publication number 20060084240
- Publication date Apr 20, 2006
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for making semiconductor packages with leadframe grid arrays
- Publication number 20050230808
- Publication date Oct 20, 2005
- Chan Min Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for packaging circuits
- Publication number 20050029668
- Publication date Feb 10, 2005
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged microelectronic components
- Publication number 20050026325
- Publication date Feb 3, 2005
- Eng Meow Koon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices including peripherally located bond pads, int...
- Publication number 20040124523
- Publication date Jul 1, 2004
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged microelectronic components
- Publication number 20040026773
- Publication date Feb 12, 2004
- Eng Meow Koon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices and semiconductor device components with peri...
- Publication number 20030230802
- Publication date Dec 18, 2003
- Chia Yong Poo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING PERIPHERALLY LOCATED BOND PADS, ASS...
- Publication number 20030232460
- Publication date Dec 18, 2003
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices and semiconductor device components with peri...
- Publication number 20030232462
- Publication date Dec 18, 2003
- Chia Yong Poo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor packages with leadframe grid arrays and components an...
- Publication number 20030193091
- Publication date Oct 16, 2003
- Chan Min Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for making semiconductor packages with leadframe grid arrays
- Publication number 20030194837
- Publication date Oct 16, 2003
- Chan Min Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable semiconductor package and wafer level fabrication method
- Publication number 20030094683
- Publication date May 22, 2003
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE SEMICONDUCTOR PACKAGE AND WAFER LEVEL FABRICATION METHOD
- Publication number 20030096454
- Publication date May 22, 2003
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for packaging circuits
- Publication number 20030067001
- Publication date Apr 10, 2003
- Micron Technology, Inc.
- Chin Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS

Chan Min Yu

Person

Patents Grantslast 30 patents

Packaged microelectronic components with terminals exposed through...

Apparatus and method for packaging circuits

Apparatus and method for packaging circuits

Apparatus and method for packaging circuits

Method for fabricating packaged die

Support elements for semiconductor devices with peripherally locate...

Semiconductor devices and semiconductor device components with peri...

Packaged microelectronic components

In-process semiconductor packages with leadframe grid arrays

Semiconductor devices including peripherally located bond pads, int...

Methods for making semiconductor packages with leadframe grid arrays

Apparatus and method for packaging circuits

Semiconductor packages with leadframe grid arrays and components

Packaged microelectronic components

Semiconductor devices and semiconductor device components with peri...

Semiconductor devices including peripherally located bond pads, ass...

Wafer level stackable semiconductor package

Stackable semiconductor package and wafer level fabrication method

Semiconductor device package side-by-side stacking and mounting system

Semiconductor device package side-by-side stacking and mounting system

Patents Applicationslast 30 patents

APPARATUS AND METHOD FOR PACKAGING CIRCUITS

PACKAGED MICROELECTRONIC COMPONENTS

APPARATUS AND METHOD FOR PACKAGING CIRCUITS

Semiconductor packages having leadframe-based connection arrays

Semiconductor devices including peripherally located bond pads, int...

Support elements for semiconductor devices with peripherally locate...

Apparatus and method for packaging circuits

Methods for making semiconductor packages with leadframe grid arrays

Apparatus and method for packaging circuits

Packaged microelectronic components

Semiconductor devices including peripherally located bond pads, int...

Packaged microelectronic components

Semiconductor devices and semiconductor device components with peri...

SEMICONDUCTOR DEVICES INCLUDING PERIPHERALLY LOCATED BOND PADS, ASS...

Semiconductor devices and semiconductor device components with peri...

Semiconductor packages with leadframe grid arrays and components an...

Methods for making semiconductor packages with leadframe grid arrays

Stackable semiconductor package and wafer level fabrication method

STACKABLE SEMICONDUCTOR PACKAGE AND WAFER LEVEL FABRICATION METHOD

Apparatus and method for packaging circuits