Chan Peng YEEN

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Die attach method and leadframe structure
- Patent number 7,859,090
- Issue date Dec 28, 2010
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach method and microarray leadframe structure
- Patent number 7,598,122
- Issue date Oct 6, 2009
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding on thinned portions of a lead-frame configured for use...
- Patent number 7,259,460
- Issue date Aug 21, 2007
- National Semiconductor Corporation
- Jamie A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a micro-array integrated circuit package
- Patent number 7,186,588
- Issue date Mar 6, 2007
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless leadframe packaging panel featuring peripheral dummy leads
- Patent number 7,002,239
- Issue date Feb 21, 2006
- National Semiconductor Corporation
- Santhiran Nadarajah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Locking of mold compound to conductive substrate panels
- Patent number 6,963,124
- Issue date Nov 8, 2005
- National Semiconductor Corporation
- Harry Kam Cheng Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless leadframe package design that provides a greater structura...
- Patent number 6,933,174
- Issue date Aug 23, 2005
- National Semiconductor Corporation
- Harry Kam Cheng Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-low loop wire bonding
- Patent number 6,933,223
- Issue date Aug 23, 2005
- National Semiconductor Corporation
- Lim Peng Soon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadless leadframe package design that provides a greater structura...
- Patent number 6,818,970
- Issue date Nov 16, 2004
- National Semiconductor Corporation
- Harry Kam Cheng Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Locking of mold compound to conductive substrate panels
- Patent number 6,808,961
- Issue date Oct 26, 2004
- National Semiconductor Corporation
- Harry Kam Cheng Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless leadframe package design that provides a greater structura...
- Patent number 6,677,667
- Issue date Jan 13, 2004
- National Semiconductor Corporation
- Harry Kam Cheng Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Locking of mold compound to conductive substrate panels
- Patent number 6,576,989
- Issue date Jun 10, 2003
- National Semiconductor Corporation
- Harry Kam Cheng Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin indicator for leadless leadframe packages
- Patent number 6,448,107
- Issue date Sep 10, 2002
- National Semiconductor Corporation
- Harry Kam Cheng Hong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE ATTACH METHOD AND LEADFRAME STRUCTURE
- Publication number 20090315161
- Publication date Dec 24, 2009
- National Semiconductor Corporation
- Jaime A. BAYAN
- H01 - BASIC ELECTRIC ELEMENTS

Chan Peng YEEN

Person

Patents Grantslast 30 patents

Die attach method and leadframe structure

Die attach method and microarray leadframe structure

Wire bonding on thinned portions of a lead-frame configured for use...

Method of fabricating a micro-array integrated circuit package

Leadless leadframe packaging panel featuring peripheral dummy leads

Locking of mold compound to conductive substrate panels

Leadless leadframe package design that provides a greater structura...

Ultra-low loop wire bonding

Leadless leadframe package design that provides a greater structura...

Locking of mold compound to conductive substrate panels

Leadless leadframe package design that provides a greater structura...

Locking of mold compound to conductive substrate panels

Pin indicator for leadless leadframe packages

Patents Applicationslast 30 patents

DIE ATTACH METHOD AND LEADFRAME STRUCTURE