Chandra Tiwari

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic devices comprising a compressive dielectric material, an...
- Patent number 12,205,900
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming electronic devices using materials removable at...
- Patent number 12,069,856
- Issue date Aug 20, 2024
- Micron Technology, Inc.
- Chandra S. Tiwari
Information Patent Grant
Microelectronic devices including isolation structures protruding i...
- Patent number 11,800,717
- Issue date Oct 24, 2023
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,706,924
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Ramey M. Abdelrahaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,700,729
- Issue date Jul 11, 2023
- Micron Technology, Inc.
- Yi Hu
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,626,423
- Issue date Apr 11, 2023
- Micron Technology, Inc.
- Xiaosong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming electronic devices using materials removable at...
- Patent number 11,476,268
- Issue date Oct 18, 2022
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods of forming memory arrays
- Patent number 11,444,093
- Issue date Sep 13, 2022
- Micron Technology, Inc.
- Chandra Tiwari
- G11 - INFORMATION STORAGE
Information Patent Grant
Inductive testing probe apparatus for testing semiconductor die and...
- Patent number 11,402,426
- Issue date Aug 2, 2022
- Micron Technology, Inc.
- Tony M. Lindenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,329,064
- Issue date May 10, 2022
- Micron Technology, Inc.
- Ramey M. Abdelrahaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including isolation structures protruding i...
- Patent number 11,322,516
- Issue date May 3, 2022
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry, memory arrays comprising strings of memory ce...
- Patent number 11,302,712
- Issue date Apr 12, 2022
- Micron Technology, Inc.
- Chandra Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with three-dimensional structures and support elements to i...
- Patent number 11,276,658
- Issue date Mar 15, 2022
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,205,654
- Issue date Dec 21, 2021
- Micron Technology, Inc.
- Yi Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge cut debond using a temporary filler material with no adhesive...
- Patent number 11,094,684
- Issue date Aug 17, 2021
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,075,219
- Issue date Jul 27, 2021
- Micron Technology, Inc.
- Xiaosong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having discretely located passivation materia...
- Patent number 10,896,886
- Issue date Jan 19, 2021
- Micron Technology, Inc.
- Mayukhee Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductive testing probe apparatus for testing semiconductor die and...
- Patent number 10,852,344
- Issue date Dec 1, 2020
- Micron Technology, Inc.
- Tony M. Lindenberg
- G01 - MEASURING TESTING
Information Patent Grant
Methods for enhancing adhesion of three-dimensional structures to s...
- Patent number 10,790,251
- Issue date Sep 29, 2020
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge cut debond using a temporary filler material with no adhesive...
- Patent number 10,403,618
- Issue date Sep 3, 2019
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having discretely located passivation materia...
- Patent number 10,262,961
- Issue date Apr 16, 2019
- Micron Technology, Inc.
- Mayukhee Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having discretely located passivation materia...
- Patent number 10,002,840
- Issue date Jun 19, 2018
- Micron Technology, Inc.
- Mayukhee Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of selectively growing nickel-containing materials
- Patent number 8,062,969
- Issue date Nov 22, 2011
- Micron Technology, Inc.
- Chandra Tiwari
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming conductive interconnects
- Patent number 7,820,545
- Issue date Oct 26, 2010
- Micron Technology, Inc.
- Chandra Tiwari
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming conductive interconnects, and methods of deposit...
- Patent number 7,358,170
- Issue date Apr 15, 2008
- Micron Technology, Inc.
- Chandra Tiwari
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming conductive interconnects, and methods of deposit...
- Patent number 6,933,231
- Issue date Aug 23, 2005
- Micron Technology, Inc.
- Chandra Tiwari
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Memory Circuitry And Method Used In Forming Memory Circuitry
- Publication number 20240071932
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS MITIGATION FOR THREE-DIMENSIONAL METAL CONTACTS
- Publication number 20240071819
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Circuitry And Method Used In Forming Memory Circuitry
- Publication number 20240047346
- Publication date Feb 8, 2024
- Micron Technology, Inc.
- Rutuparna Narulkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING A COMPRESSIVE DIELECTRIC MATERIAL, AN...
- Publication number 20230378069
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING SLOT STRUCTURES, AND RELATED ELEC...
- Publication number 20230335439
- Publication date Oct 19, 2023
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230292510
- Publication date Sep 14, 2023
- Micron Technology, Inc.
- Ramey M. Abdelrahaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20230209827
- Publication date Jun 29, 2023
- Micron Technology, Inc.
- Xiaosong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING ELECTRONIC DEVICES USING MATERIALS REMOVABLE AT...
- Publication number 20230061820
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING ISOLATION STRUCTURES PROTRUDING I...
- Publication number 20220262820
- Publication date Aug 18, 2022
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20220238553
- Publication date Jul 28, 2022
- Micron Technology, Inc.
- Ramey M. Abdelrahaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20220077169
- Publication date Mar 10, 2022
- Micron Technology, Inc.
- Yi Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING ISOLATION STRUCTURES PROTRUDING I...
- Publication number 20220068955
- Publication date Mar 3, 2022
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20210391352
- Publication date Dec 16, 2021
- Micron Technology, Inc.
- Ramey M. Abdelrahaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING ELECTRONIC DEVICES USING MATERIALS REMOVABLE AT...
- Publication number 20210375898
- Publication date Dec 2, 2021
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuitry, Memory Arrays Comprising Strings Of Memory Ce...
- Publication number 20210335803
- Publication date Oct 28, 2021
- Micron Technology, Inc.
- Chandra Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Of Forming Memory Arrays
- Publication number 20210217761
- Publication date Jul 15, 2021
- Micron Technology, Inc.
- Chandra Tiwari
- G11 - INFORMATION STORAGE
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20210057433
- Publication date Feb 25, 2021
- Micron Technology, Inc.
- Xiaosong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20210057428
- Publication date Feb 25, 2021
- Micron Technology, Inc.
- Yi Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE TESTING PROBE APPARATUS FOR TESTING SEMICONDUCTOR DIE AND...
- Publication number 20210041495
- Publication date Feb 11, 2021
- Micron Technology, Inc.
- Tony M. Lindenberg
- G01 - MEASURING TESTING
Information Patent Application
DEVICES THREE-DIMENSIONAL STRUCTURES TO SUBSTRATES
- Publication number 20200365542
- Publication date Nov 19, 2020
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ENHANCING ADHESION OF THREE-DIMENIONAL STRUCTURES TO SU...
- Publication number 20190393176
- Publication date Dec 26, 2019
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Cut Debond Using a Temporary Filler Material With No Adhesive...
- Publication number 20190341378
- Publication date Nov 7, 2019
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING DISCRETELY LOCATED PASSIVATION MATERIA...
- Publication number 20190189576
- Publication date Jun 20, 2019
- Micron Technology, Inc.
- Mayukhee Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE TESTING PROBE APPARATUS FOR TESTING SEMICONDUCTOR DIE AND...
- Publication number 20190178933
- Publication date Jun 13, 2019
- Micron Technology, Inc.
- Tony M. Lindenberg
- G01 - MEASURING TESTING
Information Patent Application
Edge Cut Debond Using a Temporary Filler Material With No Adhesive...
- Publication number 20190088637
- Publication date Mar 21, 2019
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING DISCRETELY LOCATED PASSIVATION MATERIA...
- Publication number 20190051623
- Publication date Feb 14, 2019
- Micron Technology, Inc.
- Mayukhee Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Selectively Growing Nickel-Containing Materials
- Publication number 20110008958
- Publication date Jan 13, 2011
- Chandra Tiwari
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods of Forming Conductive Interconnects
- Publication number 20080146022
- Publication date Jun 19, 2008
- Chandra Tiwari
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods and apparatus for filling features in microfeature workpieces
- Publication number 20070045120
- Publication date Mar 1, 2007
- Micron Technology, Inc.
- Chandra Shekhar Tiwari
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroless metal deposition methods
- Publication number 20060263528
- Publication date Nov 23, 2006
- Chandra Tiwari
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Chandra Tiwari

Person

Patents Grantslast 30 patents

Electronic devices comprising a compressive dielectric material, an...

Methods of forming electronic devices using materials removable at...

Microelectronic devices including isolation structures protruding i...

Integrated assemblies and methods of forming integrated assemblies

Memory arrays and methods used in forming a memory array comprising...

Memory arrays and methods used in forming a memory array comprising...

Methods of forming electronic devices using materials removable at...

Memory arrays and methods of forming memory arrays

Inductive testing probe apparatus for testing semiconductor die and...

Integrated assemblies and methods of forming integrated assemblies

Microelectronic devices including isolation structures protruding i...

Integrated circuitry, memory arrays comprising strings of memory ce...

Devices with three-dimensional structures and support elements to i...

Memory arrays and methods used in forming a memory array comprising...

Edge cut debond using a temporary filler material with no adhesive...

Memory arrays and methods used in forming a memory array comprising...

Semiconductor devices having discretely located passivation materia...

Inductive testing probe apparatus for testing semiconductor die and...

Methods for enhancing adhesion of three-dimensional structures to s...

Edge cut debond using a temporary filler material with no adhesive...

Semiconductor devices having discretely located passivation materia...

Semiconductor devices having discretely located passivation materia...

Methods of selectively growing nickel-containing materials

Methods of forming conductive interconnects

Methods of forming conductive interconnects, and methods of deposit...

Methods of forming conductive interconnects, and methods of deposit...

Patents Applicationslast 30 patents

Memory Circuitry And Method Used In Forming Memory Circuitry

STRESS MITIGATION FOR THREE-DIMENSIONAL METAL CONTACTS

Memory Circuitry And Method Used In Forming Memory Circuitry

ELECTRONIC DEVICES COMPRISING A COMPRESSIVE DIELECTRIC MATERIAL, AN...

MICROELECTRONIC DEVICES INCLUDING SLOT STRUCTURES, AND RELATED ELEC...

Integrated Assemblies and Methods of Forming Integrated Assemblies

Memory Arrays And Methods Used In Forming A Memory Array Comprising...

METHODS OF FORMING ELECTRONIC DEVICES USING MATERIALS REMOVABLE AT...

MICROELECTRONIC DEVICES INCLUDING ISOLATION STRUCTURES PROTRUDING I...

Integrated Assemblies and Methods of Forming Integrated Assemblies

Memory Arrays And Methods Used In Forming A Memory Array Comprising...

MICROELECTRONIC DEVICES INCLUDING ISOLATION STRUCTURES PROTRUDING I...

Integrated Assemblies and Methods of Forming Integrated Assemblies

METHODS OF FORMING ELECTRONIC DEVICES USING MATERIALS REMOVABLE AT...

Integrated Circuitry, Memory Arrays Comprising Strings Of Memory Ce...

Memory Arrays And Methods Of Forming Memory Arrays

Memory Arrays And Methods Used In Forming A Memory Array Comprising...

Memory Arrays And Methods Used In Forming A Memory Array Comprising...

INDUCTIVE TESTING PROBE APPARATUS FOR TESTING SEMICONDUCTOR DIE AND...

DEVICES THREE-DIMENSIONAL STRUCTURES TO SUBSTRATES

METHODS FOR ENHANCING ADHESION OF THREE-DIMENIONAL STRUCTURES TO SU...

Edge Cut Debond Using a Temporary Filler Material With No Adhesive...

SEMICONDUCTOR DEVICES HAVING DISCRETELY LOCATED PASSIVATION MATERIA...

INDUCTIVE TESTING PROBE APPARATUS FOR TESTING SEMICONDUCTOR DIE AND...

Edge Cut Debond Using a Temporary Filler Material With No Adhesive...

SEMICONDUCTOR DEVICES HAVING DISCRETELY LOCATED PASSIVATION MATERIA...

Methods of Selectively Growing Nickel-Containing Materials

Methods of Forming Conductive Interconnects

Methods and apparatus for filling features in microfeature workpieces

Electroless metal deposition methods