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Chandramouleeswaran Subramani
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Dual solder methodologies for ultrahigh density first level interco...
Patent number
11,908,820
Issue date
Feb 20, 2024
Intel Corporation
Chandramouleeswaran Subramani
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Site-selective metal plating onto a package dielectric
Patent number
11,319,334
Issue date
May 3, 2022
Intel Corporation
Chandramouleeswaran Subramani
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Dual solder methodologies for ultrahigh density first level interco...
Patent number
11,322,469
Issue date
May 3, 2022
Intel Corporation
Chandramouleeswaran Subramani
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Polymer grafting for enhanced dielectric and interconnect material...
Patent number
9,147,603
Issue date
Sep 29, 2015
Intel Corporation
Chandramouleeswaran Subramani
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DUAL SOLDER METHODOLOGIES FOR ULTRAHIGH DENSITY FIRST LEVEL INTERCO...
Publication number
20220165697
Publication date
May 26, 2022
Intel Corporation
Chandramouleeswaran Subramani
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SITE-SELECTIVE METAL PLATING ONTO A PACKAGE DIELECTRIC
Publication number
20190202845
Publication date
Jul 4, 2019
Intel Corporation
Chandramouleeswaran Subramani
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
DUAL SOLDER METHODOLOGIES FOR ULTRAHIGH DENSITY FIRST LEVEL INTERCO...
Publication number
20190189581
Publication date
Jun 20, 2019
Intel Corporation
Chandramouleeswaran Subramani
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
POLYMER GRAFTING FOR ENHANCED DIELECTRIC AND INTERCONNECT MATERIAL...
Publication number
20150206793
Publication date
Jul 23, 2015
Chandramouleeswaran Subramani
H01 - BASIC ELECTRIC ELEMENTS