Chandrashekar Ramaswamy

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of making substrate package with through holes for high spee...
- Patent number 8,353,101
- Issue date Jan 15, 2013
- Intel Corporation
- Charan Gurumurthy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PACKAGE WITH THROUGH HOLES FOR HIGH SPEED I/O FLEX CABLE
- Publication number 20110108427
- Publication date May 12, 2011
- Charan Gurumurthy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR