Chandrashekhar Ramaswamy

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Input/output package architectures
- Patent number 8,188,594
- Issue date May 29, 2012
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate package with through holes for high speed I/O flex cable
- Patent number 7,888,784
- Issue date Feb 15, 2011
- Intel Corporation
- Charan Gurumurthy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Input/output package architectures, and methods of using same
- Patent number 7,705,447
- Issue date Apr 27, 2010
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Providing variable sized contacts for coupling with a semiconductor...
- Patent number 7,530,814
- Issue date May 12, 2009
- Intel Corporation
- Chandrashekhar Ramaswamy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple power density chip structure
- Patent number 7,193,318
- Issue date Mar 20, 2007
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Input/output package architectures, and methods of using same
- Publication number 20100096743
- Publication date Apr 22, 2010
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PACKAGE WITH THROUGH HOLES FOR HIGH SPEED I/O FLEX CABLE
- Publication number 20100078826
- Publication date Apr 1, 2010
- Charan Gurumurthy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INPUT/OUTPUT PACKAGE ARCHITECTURES, AND METHODS OF USING SAME
- Publication number 20100078781
- Publication date Apr 1, 2010
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Providing variable sized contacts for coupling with a semiconductor...
- Publication number 20090081889
- Publication date Mar 26, 2009
- Chandrashekhar Ramaswamy
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Compliant interconnects for semiconductors and micromachines
- Publication number 20060087032
- Publication date Apr 27, 2006
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE POWER DENSITY CHIP STRUCTURE
- Publication number 20060038281
- Publication date Feb 23, 2006
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS