Chang-An Yuan

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Kaohsiung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
3D electronic packaging structure having a conductive support subst...
- Patent number 7,884,464
- Issue date Feb 8, 2011
- Advanced Chip Engineering Technologies Inc.
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional multichip stack electronic package structure
- Patent number 7,211,886
- Issue date May 1, 2007
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3D electronic packaging structure having a conductive support subst...
- Publication number 20070296065
- Publication date Dec 27, 2007
- Advanced Chip Engineering Technology Inc.
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional multichip stack electronic package structure
- Publication number 20060273439
- Publication date Dec 7, 2006
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional multichip stack electronic package structure
- Publication number 20050224947
- Publication date Oct 13, 2005
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS