Chang Bu Jeong

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Gyeonggi-do, KR

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Patents Grantslast 30 patents

Information Patent Grant
Die pickup module and die bonding apparatus including the same
- Patent number 12,090,642
- Issue date Sep 17, 2024
- Semes Co., Ltd.
- Chang Bu Jeong
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Die pickup module and die bonding apparatus including the same
- Patent number 11,600,515
- Issue date Mar 7, 2023
- Semes Co., Ltd.
- Chang Bu Jeong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE PICKUP MODULE AND DIE BONDING APPARATUS INCLUDING THE SAME
- Publication number 20210060798
- Publication date Mar 4, 2021
- SEMES CO., LTD.
- Chang Bu Jeong
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS