Chang-Ching Yeh

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Wearable device
- Patent number 12,186,094
- Issue date Jan 7, 2025
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 12,176,276
- Issue date Dec 24, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 12,087,652
- Issue date Sep 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,089,349
- Issue date Sep 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,997,888
- Issue date May 28, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,948,852
- Issue date Apr 2, 2024
- ADVANCED SEMICONDUTOR ENGINEERING, INC.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,942,385
- Issue date Mar 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly
- Patent number 11,862,544
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,744,024
- Issue date Aug 29, 2023
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,710,689
- Issue date Jul 25, 2023
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quantum dot structure with excellent stability and method for makin...
- Patent number 11,685,861
- Issue date Jun 27, 2023
- National Tsing Hua University
- Chang-Wei Yeh
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 11,626,360
- Issue date Apr 11, 2023
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method for manufacturing the same
- Patent number 11,575,995
- Issue date Feb 7, 2023
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,462,455
- Issue date Oct 4, 2022
- Advanced Semiconductor Engineering, Inc.
- Shiu-Fang Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection of buried features by backscattered particles
- Patent number 11,443,915
- Issue date Sep 13, 2022
- ASML Netherlands B.V.
- Joe Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,437,415
- Issue date Sep 6, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,410,899
- Issue date Aug 9, 2022
- Advanced Semiconductor Engineering, Inc.
- Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,289,394
- Issue date Mar 29, 2022
- Advanced Semiconductor Engineering, Inc.
- Sheng-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quantum dot
- Patent number 11,279,874
- Issue date Mar 22, 2022
- National Tsing Hua University
- Hsueh-Shih Chen
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,222,792
- Issue date Jan 11, 2022
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,224,132
- Issue date Jan 11, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package
- Patent number 11,211,302
- Issue date Dec 28, 2021
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,201,200
- Issue date Dec 14, 2021
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 11,133,244
- Issue date Sep 28, 2021
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,081,473
- Issue date Aug 3, 2021
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,991,656
- Issue date Apr 27, 2021
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having an electrical contact with a hi...
- Patent number 10,861,779
- Issue date Dec 8, 2020
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,629,454
- Issue date Apr 21, 2020
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,580,713
- Issue date Mar 3, 2020
- Advanced Semiconductor Engineering, Inc.
- Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and semiconductor package device
- Patent number 10,483,254
- Issue date Nov 19, 2019
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TERMINAL STRIP STRUCTURE, CONNECTOR DEVICE AND ITS CONDUCTIVE TERMINAL
- Publication number 20250047018
- Publication date Feb 6, 2025
- Jentech Precision Industrial Co., LTD.
- Shan-Yong CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429115
- Publication date Dec 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY
- Publication number 20240145357
- Publication date May 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR QUANTUM DOT STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20240052241
- Publication date Feb 15, 2024
- National Tsing-Hua University
- Chang-Wei YEH
- B82 - NANO-TECHNOLOGY
Information Patent Application
QUANTUM DOT AND METHOD FOR PREPARING THE SAME
- Publication number 20240023357
- Publication date Jan 18, 2024
- National Tsing-Hua University
- Chang-Wei YEH
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230413454
- Publication date Dec 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230245963
- Publication date Aug 3, 2023
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20230215775
- Publication date Jul 6, 2023
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEARABLE DEVICE
- Publication number 20230042984
- Publication date Feb 9, 2023
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230026633
- Publication date Jan 26, 2023
- Advanced Semiconductor Engineering, Inc.
- Shiu-Fang YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230005970
- Publication date Jan 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220384289
- Publication date Dec 1, 2022
- Advanced Semiconductor Engineering, Inc.
- Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220353619
- Publication date Nov 3, 2022
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220344234
- Publication date Oct 27, 2022
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20220344246
- Publication date Oct 27, 2022
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220336317
- Publication date Oct 20, 2022
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM DOT STRUCTURE WITH EXCELLENT STABILITY AND METHOD FOR MAKIN...
- Publication number 20220267672
- Publication date Aug 25, 2022
- National Tsing-Hua University
- Chang-Wei YEH
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220223489
- Publication date Jul 14, 2022
- Advanced Semiconductor Engineering, Inc.
- Sheng-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220141971
- Publication date May 5, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220102453
- Publication date Mar 31, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220013443
- Publication date Jan 13, 2022
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM DOT
- Publication number 20210340440
- Publication date Nov 4, 2021
- National Tsing-Hua University
- Hsueh-Shih CHEN
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210193545
- Publication date Jun 24, 2021
- Advanced Semiconductor Engineering, Inc.
- Sheng-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20210118760
- Publication date Apr 22, 2021
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210090982
- Publication date Mar 25, 2021
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210076510
- Publication date Mar 11, 2021
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210066354
- Publication date Mar 4, 2021
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210057572
- Publication date Feb 25, 2021
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210057398
- Publication date Feb 25, 2021
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200402897
- Publication date Dec 24, 2020
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H01 - BASIC ELECTRIC ELEMENTS

Chang-Ching Yeh

Person

Patents Grantslast 30 patents

Wearable device

Semiconductor device package and method for manufacturing the same

Semiconductor package device and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package

Semiconductor package structure

Electronic assembly

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Quantum dot structure with excellent stability and method for makin...

Semiconductor device package and method for manufacturing the same

Semiconductor package device and method for manufacturing the same

Semiconductor package device and method of manufacturing the same

Detection of buried features by backscattered particles

Semiconductor device package and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

Semiconductor package structure

Quantum dot

Semiconductor package device and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method for manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package

Semiconductor device package having an electrical contact with a hi...

Semiconductor package device and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

Electronic module and semiconductor package device

Patents Applicationslast 30 patents

TERMINAL STRIP STRUCTURE, CONNECTOR DEVICE AND ITS CONDUCTIVE TERMINAL

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC ASSEMBLY

SEMICONDUCTOR QUANTUM DOT STRUCTURE AND METHOD FOR MAKING THE SAME

QUANTUM DOT AND METHOD FOR PREPARING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC PACKAGE AND METHOD OF FORMING THE SAME

WEARABLE DEVICE

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC ASSEMBLY AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

QUANTUM DOT STRUCTURE WITH EXCELLENT STABILITY AND METHOD FOR MAKIN...

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

QUANTUM DOT

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME