Chang-Fu Lin

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Taiwan, CN

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 8,698,326
- Issue date Apr 15, 2014
- Silconware Precision Industries Co., Ltd.
- Wen-Home Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating structure and heat-dissipating semiconductor packa...
- Patent number 7,863,731
- Issue date Jan 4, 2011
- Siliconware Precision Industries Co., Ltd.
- Chin-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS