Chang-han Shim

Person

Changwon-city, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board with multiple metallic layers and method of m...
- Patent number 8,409,726
- Issue date Apr 2, 2013
- Samsung Techwin Co., Ltd.
- Chang-han Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame manufactured from low-priced material and not requiring...
- Patent number 8,354,741
- Issue date Jan 15, 2013
- Samsung Techwin Co., Ltd.
- Sung-il Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and method of manufacturing the same
- Patent number 8,319,340
- Issue date Nov 27, 2012
- Samsung Techwin Co., Ltd.
- Chang-han Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board viaholes and method of manufacturing the same
- Patent number 8,278,564
- Issue date Oct 2, 2012
- Samsung Techwin Co., Ltd.
- Chang-han Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame manufactured from low-priced material and not requiring...
- Patent number 8,110,505
- Issue date Feb 7, 2012
- Samsung Techwin Co., Ltd.
- Sung-il Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD VIAHOLES AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120279775
- Publication date Nov 8, 2012
- Samsung Techwin Co., Ltd.
- Chang-han Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME MANUFACTURED FROM LOW-PRICED MATERIAL AND NOT REQUIRING...
- Publication number 20120098112
- Publication date Apr 26, 2012
- Samsung Techwin Co., Ltd.
- Sung-il Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110079887
- Publication date Apr 7, 2011
- Samsung Techwin Co., Ltd.
- Chang-han SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD WITH MULTIPLE METALLIC LAYERS AND METHOD OF M...
- Publication number 20100116528
- Publication date May 13, 2010
- Samsung Techwin Co., Ltd.
- Chang-han Shim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD VIAHOLES AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090283316
- Publication date Nov 19, 2009
- Samsung Techwin Co., Ltd.
- Chang-han Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...
- Publication number 20090283884
- Publication date Nov 19, 2009
- Samsung Techwin Co., Ltd.
- Sung-il Kang
- H01 - BASIC ELECTRIC ELEMENTS

Chang-han Shim

Person

Patents Grantslast 30 patents

Printed circuit board with multiple metallic layers and method of m...

Lead frame manufactured from low-priced material and not requiring...

Lead frame and method of manufacturing the same

Circuit board viaholes and method of manufacturing the same

Lead frame manufactured from low-priced material and not requiring...

Patents Applicationslast 30 patents

CIRCUIT BOARD VIAHOLES AND METHOD OF MANUFACTURING THE SAME

LEAD FRAME MANUFACTURED FROM LOW-PRICED MATERIAL AND NOT REQUIRING...

LEAD FRAME AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD WITH MULTIPLE METALLIC LAYERS AND METHOD OF M...

CIRCUIT BOARD VIAHOLES AND METHOD OF MANUFACTURING THE SAME

LEAD FRAME, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...