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New Territories, HK
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor chip with through-silicon-via and sidewall pad
Patent number
8,674,482
Issue date
Mar 18, 2014
Hong Kong Applied Science and Technology Research Institute Co. Ltd.
Xunqing Shi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of making an electronic component package and semiconductor...
Patent number
8,241,966
Issue date
Aug 14, 2012
Hong Kong Applied Science and Technology Research Institute Company Limited
Man-Lung Sham
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pulse-laser bonding method for through-silicon-via based stacking o...
Patent number
8,138,577
Issue date
Mar 20, 2012
Hong Kong Applied Science and Technology Research Institute Co., Ltd.
Xunqing Shi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding method for through-silicon-via based 3D wafer stacking
Patent number
8,030,208
Issue date
Oct 4, 2011
Hong Kong Applied Science and Technology Research Institute Company Limited
Chi Kuen Vincent Leung
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Piezoelectric module for energy harvesting, such as in a tire press...
Patent number
8,011,237
Issue date
Sep 6, 2011
Hong Kong Applied Science and Technology Research Institute Co., Ltd.
Ziyang Gao
B60 - VEHICLES IN GENERAL
Information
Patent Grant
Apparatus and method for generating electricity using piezoelectric...
Patent number
7,902,727
Issue date
Mar 8, 2011
Hong Kong Applied Science and Technology Research Institute Co. Ltd.
Man-Lung Sham
A43 - FOOTWEAR
Information
Patent Grant
Substrate warpage-reducing structure
Patent number
7,879,438
Issue date
Feb 1, 2011
Hong Kong Applied Science and Technology Research Institute Co., Ltd.
Jyh-Rong Lin
C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information
Patent Grant
Bonding method for through-silicon-via based 3D wafer stacking
Patent number
7,683,459
Issue date
Mar 23, 2010
Hong Kong Applied Science and Technology Research Institute Company, Ltd.
Wei Ma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked multi-chip package with EMI shielding
Patent number
7,514,774
Issue date
Apr 7, 2009
Hong Kong Applied Science Technology Research Institute Company Limited
Lap Wai Leung
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
APPARATUS AND METHOD FOR GENERATING ELECTRICITY USING PIEZOELECTRIC...
Publication number
20110037349
Publication date
Feb 17, 2011
Man-Lung Sham
A43 - FOOTWEAR
Information
Patent Application
SUBSTRATE WARPAGE-REDUCING STRUCTURE
Publication number
20100247879
Publication date
Sep 30, 2010
Hong Kong Applied Science and Technology Researh Institute Co. Ltd.
Jyh-Rong Lin
C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information
Patent Application
ELECTRONIC PACKAGE AND METHOD OF FABRICATION THEREOF
Publication number
20100246141
Publication date
Sep 30, 2010
Hong Kong Applied Science and Technology Research Institute Co. Ltd. (ASTRI)
Chi Kuen Vincent Leung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP WITH THROUGH-SILICON-VIA AND SIDEWALL PAD
Publication number
20100123241
Publication date
May 20, 2010
Hong Kong Applied Science and Technology Research Institute Co., Ltd.
Xunqing Shi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING METHOD FOR THROUGH-SILICON-VIA BASED 3D WAFER STACKING
Publication number
20090294974
Publication date
Dec 3, 2009
Chi Keun Vincent Leung
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING METHOD FOR THROUGH-SILICON-VIA BASED 3D WAFER STACKING
Publication number
20090294916
Publication date
Dec 3, 2009
Hong Kong Applied Science and Technology Research Institute Company, Ltd.
Wei Ma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP PACKAGE
Publication number
20090293604
Publication date
Dec 3, 2009
Hong Kong Applied Science and Technology Research Institute Company Limited (...
Man Lung Sham
B60 - VEHICLES IN GENERAL
Information
Patent Application
Methods of Making an Electronic Component Package and Semiconductor...
Publication number
20090294931
Publication date
Dec 3, 2009
Man-Lung Sham
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Pulse-Laser Bonding Method for Through-Silicon-Via Based Stacking o...
Publication number
20090243046
Publication date
Oct 1, 2009
Xunqing Shi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PIEZOELECTRIC MODULE FOR ENERGY HARVESTING, SUCH AS IN A TIRE PRESS...
Publication number
20090211353
Publication date
Aug 27, 2009
Hong Kong Applied Science and Technology Research Institute Company Limited (...
Ziyang Gao
B60 - VEHICLES IN GENERAL
Information
Patent Application
Electronic Circuit Package
Publication number
20090189269
Publication date
Jul 30, 2009
Lap-Wai Lydia Leung
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Stacked multi-chip package with EMI shielding
Publication number
20080067656
Publication date
Mar 20, 2008
Hong Kong Applied Science
Lap Wai Leung
H01 - BASIC ELECTRIC ELEMENTS