Chang Hwa Chung

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Hong Kong, CN

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Patents Grantslast 30 patents

Information Patent Grant
IC packages with internal heat dissipation structures
- Patent number 8,031,484
- Issue date Oct 4, 2011
- Hong Kong Applied Science and Technology Research Institute Co., Ltd.
- Huili Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for identification of wheels of a vehicle and...
- Patent number 7,860,634
- Issue date Dec 28, 2010
- Hong Kong Applied Science and Technology Research Institute Co., Ltd.
- Kwan Wai Raymond To
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC HEALTH RECORD STORAGE DEVICE, SYSTEM, AND METHOD
- Publication number 20110245627
- Publication date Oct 6, 2011
- Hong Kong Applied Science and Technology Research Institute Co., Ltd.
- Lydia Lap Wai Leung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic Circuit Package
- Publication number 20090115051
- Publication date May 7, 2009
- Lap-Wai Lydia Leung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for identification of wheels of a vehicle and...
- Publication number 20090088939
- Publication date Apr 2, 2009
- Hong Kong Applied Science and Technology Research Institute Co. Ltd.
- Kwan Wai To
- B60 - VEHICLES IN GENERAL
Information Patent Application
Electronic component package with EMI shielding
- Publication number 20080067650
- Publication date Mar 20, 2008
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Man-Lung Sham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC packages with internal heat dissipation structures
- Publication number 20070291457
- Publication date Dec 20, 2007
- Huili Fu
- H01 - BASIC ELECTRIC ELEMENTS