Chang-Jung Hsueh

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure having lid with protrusion and manufacturing meth...
- Patent number 12,094,792
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,068,303
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and method for forming the same
- Patent number 12,015,002
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with conduct...
- Patent number 11,990,440
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,961,944
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for forming a package structure
- Patent number 11,961,817
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai Jun Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package, and methods of manufac...
- Patent number 11,901,256
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including stress-resistant bonding structures and...
- Patent number 11,887,955
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with conduct...
- Patent number 11,854,964
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,855,058
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer structures and methods of forming
- Patent number 11,742,204
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,569,419
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with protected bump and method of fo...
- Patent number 11,171,100
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,094,655
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer structures and methods of forming
- Patent number 11,004,685
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFEC...
- Publication number 20240404839
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA WITH TEXTURED STRUCTURE AND FOOTING FEATURES
- Publication number 20240395666
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240387430
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371715
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240332235
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS
- Publication number 20240258259
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240234637
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A PACKAGE STRUCTURE
- Publication number 20240222312
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai Jun ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFAC...
- Publication number 20240145327
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240128148
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...
- Publication number 20240128219
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS
- Publication number 20240096787
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240088119
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240038752
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTED TRAPEZOIDAL HEAT DISSIPATING SOLDER STRUCTURE AND METHOD O...
- Publication number 20230386964
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Jung HSUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Structures and Methods of Forming
- Publication number 20230369049
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230170443
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFAC...
- Publication number 20230068485
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CONDUCT...
- Publication number 20230065724
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230065147
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230062370
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230067143
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...
- Publication number 20230065797
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CONDUCT...
- Publication number 20230063127
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR FORMING A PACKAGE STRUCTURE
- Publication number 20220278071
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai Jun ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220140197
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Structures and Methods of Forming
- Publication number 20210265165
- Publication date Aug 26, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTED BUMP AND METHOD OF F...
- Publication number 20210159197
- Publication date May 27, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200395323
- Publication date Dec 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hsiung LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER STRUCTURES AND METHODS OF FORMING
- Publication number 20200176254
- Publication date Jun 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS

Chang-Jung Hsueh

Person

Patents Grantslast 30 patents

Package structure having lid with protrusion and manufacturing meth...

Package structure

Chip structure and method for forming the same

Structure and formation method of semiconductor device with conduct...

Semiconductor device and manufacturing method thereof

Apparatus and method for forming a package structure

Semiconductor device, semiconductor package, and methods of manufac...

Semiconductor die including stress-resistant bonding structures and...

Structure and formation method of semiconductor device with conduct...

Package structure and method of forming the same

Multi-layer structures and methods of forming

Semiconductor device and manufacturing method thereof

Semiconductor device structure with protected bump and method of fo...

Semiconductor structure and method for forming the same

Multi-layer structures and methods of forming

Patents Applicationslast 30 patents

WIRE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFEC...

THROUGH SILICON VIA WITH TEXTURED STRUCTURE AND FOOTING FEATURES

METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING A PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFAC...

Integrated Circuit Packages and Methods of Forming the Same

SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...

SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE

INVERTED TRAPEZOIDAL HEAT DISSIPATING SOLDER STRUCTURE AND METHOD O...

Multi-Layer Structures and Methods of Forming

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFAC...

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CONDUCT...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

CHIP STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CONDUCT...

APPARATUS AND METHOD FOR FORMING A PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Multi-Layer Structures and Methods of Forming

SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTED BUMP AND METHOD OF F...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

MULTI-LAYER STRUCTURES AND METHODS OF FORMING