Chang-Lun Lu

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating electronic package
- Patent number 10,796,970
- Issue date Oct 6, 2020
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of electronic module
- Patent number 10,461,002
- Issue date Oct 29, 2019
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 10,403,570
- Issue date Sep 3, 2019
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication method thereof
- Patent number 10,242,972
- Issue date Mar 26, 2019
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of electronic package
- Patent number 10,211,082
- Issue date Feb 19, 2019
- Silicon Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,201,086
- Issue date Feb 5, 2019
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 10,141,233
- Issue date Nov 27, 2018
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 10,128,178
- Issue date Nov 13, 2018
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and semiconductor substrate
- Patent number 9,899,309
- Issue date Feb 20, 2018
- Siliconware Precision Industries Co., Ltd.
- Shih-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, semiconductor substrate of the electronic packa...
- Patent number 9,831,191
- Issue date Nov 28, 2017
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier structure, packaging substrate, electronic package and fabr...
- Patent number 9,818,635
- Issue date Nov 14, 2017
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and fabrication method thereof
- Patent number 9,735,075
- Issue date Aug 15, 2017
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 9,601,403
- Issue date Mar 21, 2017
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure with first and second conductive bumps having d...
- Patent number 9,515,039
- Issue date Dec 6, 2016
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interposer and package structure having the same
- Patent number 9,263,380
- Issue date Feb 16, 2016
- Siliconware Precision Industries Co., Ltd.
- Jyun-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20190057911
- Publication date Feb 21, 2019
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20190043798
- Publication date Feb 7, 2019
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF ELECTRONIC PACKAGE
- Publication number 20180047610
- Publication date Feb 15, 2018
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20180042112
- Publication date Feb 8, 2018
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20170338173
- Publication date Nov 23, 2017
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF ELECTRONIC MODULE
- Publication number 20170309534
- Publication date Oct 26, 2017
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND SEMICONDUCTOR SUBSTRATE
- Publication number 20170256481
- Publication date Sep 7, 2017
- Siliconware Precision Industries Co., Ltd.
- Shih-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, SEMICONDUCTOR SUBSTRATE OF THE ELECTRONIC PACKA...
- Publication number 20170243834
- Publication date Aug 24, 2017
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20170148761
- Publication date May 25, 2017
- Siliconware Precision Industries Co., Ltd.
- Guang-Hwa Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, CHIP STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20170084562
- Publication date Mar 23, 2017
- Siliconware Precision Industries Co., Ltd.
- Jyun-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20170047262
- Publication date Feb 16, 2017
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE, PACKAGING SUBSTRATE, ELECTRONIC PACKAGE AND FABR...
- Publication number 20170033027
- Publication date Feb 2, 2017
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20170005023
- Publication date Jan 5, 2017
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE WITH FIRST AND SECOND CONDUCTIVE BUMPS HAVING D...
- Publication number 20160322323
- Publication date Nov 3, 2016
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160233194
- Publication date Aug 11, 2016
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE AND FABRICATION METHOD THEREOF
- Publication number 20160066406
- Publication date Mar 3, 2016
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PACKAGE STRUCTURE, CHIP STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20150325545
- Publication date Nov 12, 2015
- Siliconware Precision Industries Co., Ltd.
- Jyun-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERPOSER AND PACKAGE STRUCTURE HAVING THE SAME
- Publication number 20150303138
- Publication date Oct 22, 2015
- Siliconware Precision Industries Co., Ltd.
- Jyun-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150035164
- Publication date Feb 5, 2015
- Siliconware Precision Industries Co., Ltd.
- Guang-Hwa Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150035163
- Publication date Feb 5, 2015
- Siliconware Precision Industries Co., Ltd.
- Guang-Hwa Ma
- H01 - BASIC ELECTRIC ELEMENTS

Chang-Lun Lu

Person

Patents Grantslast 30 patents

Method for fabricating electronic package

Fabrication method of electronic module

Method for fabricating electronic package

Package structure and fabrication method thereof

Fabrication method of electronic package

Electronic device

Electronic package and fabrication method thereof

Electronic package and method for fabricating the same

Electronic package and semiconductor substrate

Electronic package, semiconductor substrate of the electronic packa...

Carrier structure, packaging substrate, electronic package and fabr...

Electronic module and fabrication method thereof

Electronic package and fabrication method thereof

Substrate structure with first and second conductive bumps having d...

Semiconductor interposer and package structure having the same

Patents Applicationslast 30 patents

METHOD FOR FABRICATING ELECTRONIC PACKAGE

METHOD FOR FABRICATING ELECTRONIC PACKAGE

FABRICATION METHOD OF ELECTRONIC PACKAGE

ELECTRONIC DEVICE

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

FABRICATION METHOD OF ELECTRONIC MODULE

ELECTRONIC PACKAGE AND SEMICONDUCTOR SUBSTRATE

ELECTRONIC PACKAGE, SEMICONDUCTOR SUBSTRATE OF THE ELECTRONIC PACKA...

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE, CHIP STRUCTURE AND FABRICATION METHOD THEREOF

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

CARRIER STRUCTURE, PACKAGING SUBSTRATE, ELECTRONIC PACKAGE AND FABR...

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

SUBSTRATE STRUCTURE WITH FIRST AND SECOND CONDUCTIVE BUMPS HAVING D...

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

ELECTRONIC MODULE AND FABRICATION METHOD THEREOF

PACKAGE STRUCTURE, CHIP STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR INTERPOSER AND PACKAGE STRUCTURE HAVING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME