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Patents Grants
last 30 patents
Information
Patent Grant
Method for fabricating electronic package
Patent number
10,796,970
Issue date
Oct 6, 2020
Siliconware Precision Industries Co., Ltd.
Lu-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication method of electronic module
Patent number
10,461,002
Issue date
Oct 29, 2019
Siliconware Precision Industries Co., Ltd.
Lu-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating electronic package
Patent number
10,403,570
Issue date
Sep 3, 2019
Siliconware Precision Industries Co., Ltd.
Lu-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and fabrication method thereof
Patent number
10,242,972
Issue date
Mar 26, 2019
Siliconware Precision Industries Co., Ltd.
Lu-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication method of electronic package
Patent number
10,211,082
Issue date
Feb 19, 2019
Silicon Precision Industries Co., Ltd.
Lu-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device
Patent number
10,201,086
Issue date
Feb 5, 2019
Siliconware Precision Industries Co., Ltd.
Lu-Yi Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic package and fabrication method thereof
Patent number
10,141,233
Issue date
Nov 27, 2018
Siliconware Precision Industries Co., Ltd.
Lu-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package and method for fabricating the same
Patent number
10,128,178
Issue date
Nov 13, 2018
Siliconware Precision Industries Co., Ltd.
Lu-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package and semiconductor substrate
Patent number
9,899,309
Issue date
Feb 20, 2018
Siliconware Precision Industries Co., Ltd.
Shih-Ching Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package, semiconductor substrate of the electronic packa...
Patent number
9,831,191
Issue date
Nov 28, 2017
Siliconware Precision Industries Co., Ltd.
Chieh-Lung Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier structure, packaging substrate, electronic package and fabr...
Patent number
9,818,635
Issue date
Nov 14, 2017
Siliconware Precision Industries Co., Ltd.
Lu-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic module and fabrication method thereof
Patent number
9,735,075
Issue date
Aug 15, 2017
Siliconware Precision Industries Co., Ltd.
Lu-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package and fabrication method thereof
Patent number
9,601,403
Issue date
Mar 21, 2017
Siliconware Precision Industries Co., Ltd.
Lu-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate structure with first and second conductive bumps having d...
Patent number
9,515,039
Issue date
Dec 6, 2016
Siliconware Precision Industries Co., Ltd.
Chieh-Lung Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor interposer and package structure having the same
Patent number
9,263,380
Issue date
Feb 16, 2016
Siliconware Precision Industries Co., Ltd.
Jyun-Ling Tsai
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
Publication number
20190057911
Publication date
Feb 21, 2019
Siliconware Precision Industries Co., Ltd.
Lu-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
Publication number
20190043798
Publication date
Feb 7, 2019
Siliconware Precision Industries Co., Ltd.
Lu-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATION METHOD OF ELECTRONIC PACKAGE
Publication number
20180047610
Publication date
Feb 15, 2018
Siliconware Precision Industries Co., Ltd.
Lu-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20180042112
Publication date
Feb 8, 2018
Siliconware Precision Industries Co., Ltd.
Lu-Yi Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
Publication number
20170338173
Publication date
Nov 23, 2017
Siliconware Precision Industries Co., Ltd.
Lu-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATION METHOD OF ELECTRONIC MODULE
Publication number
20170309534
Publication date
Oct 26, 2017
Siliconware Precision Industries Co., Ltd.
Lu-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND SEMICONDUCTOR SUBSTRATE
Publication number
20170256481
Publication date
Sep 7, 2017
Siliconware Precision Industries Co., Ltd.
Shih-Ching Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE, SEMICONDUCTOR SUBSTRATE OF THE ELECTRONIC PACKA...
Publication number
20170243834
Publication date
Aug 24, 2017
Siliconware Precision Industries Co., Ltd.
Chieh-Lung Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
Publication number
20170148761
Publication date
May 25, 2017
Siliconware Precision Industries Co., Ltd.
Guang-Hwa Ma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE, CHIP STRUCTURE AND FABRICATION METHOD THEREOF
Publication number
20170084562
Publication date
Mar 23, 2017
Siliconware Precision Industries Co., Ltd.
Jyun-Ling Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
Publication number
20170047262
Publication date
Feb 16, 2017
Siliconware Precision Industries Co., Ltd.
Lu-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER STRUCTURE, PACKAGING SUBSTRATE, ELECTRONIC PACKAGE AND FABR...
Publication number
20170033027
Publication date
Feb 2, 2017
Siliconware Precision Industries Co., Ltd.
Lu-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
Publication number
20170005023
Publication date
Jan 5, 2017
Siliconware Precision Industries Co., Ltd.
Lu-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE STRUCTURE WITH FIRST AND SECOND CONDUCTIVE BUMPS HAVING D...
Publication number
20160322323
Publication date
Nov 3, 2016
Siliconware Precision Industries Co., Ltd.
Chieh-Lung Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
Publication number
20160233194
Publication date
Aug 11, 2016
Siliconware Precision Industries Co., Ltd.
Lu-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC MODULE AND FABRICATION METHOD THEREOF
Publication number
20160066406
Publication date
Mar 3, 2016
Siliconware Precision Industries Co., Ltd.
Lu-Yi Chen
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
PACKAGE STRUCTURE, CHIP STRUCTURE AND FABRICATION METHOD THEREOF
Publication number
20150325545
Publication date
Nov 12, 2015
Siliconware Precision Industries Co., Ltd.
Jyun-Ling Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR INTERPOSER AND PACKAGE STRUCTURE HAVING THE SAME
Publication number
20150303138
Publication date
Oct 22, 2015
Siliconware Precision Industries Co., Ltd.
Jyun-Ling Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20150035164
Publication date
Feb 5, 2015
Siliconware Precision Industries Co., Ltd.
Guang-Hwa Ma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20150035163
Publication date
Feb 5, 2015
Siliconware Precision Industries Co., Ltd.
Guang-Hwa Ma
H01 - BASIC ELECTRIC ELEMENTS