Chang-Ming Lin

Person

Nantong, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packaging structure and method for forming the same
- Patent number 9,620,468
- Issue date Apr 11, 2017
- TONGFU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor IC packaging methods and structures
- Patent number 9,589,815
- Issue date Mar 7, 2017
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal contact for semiconductor device
- Patent number 9,548,282
- Issue date Jan 17, 2017
- Nantong Fujitsu Microelectronics Co., Ltd.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure
- Patent number 9,431,325
- Issue date Aug 30, 2016
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal contact for semiconductor device
- Patent number 9,379,077
- Issue date Jun 28, 2016
- Nantong Fujitsu Microelectronics Co., Ltd.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal contact for chip packaging structure
- Patent number 9,293,432
- Issue date Mar 22, 2016
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and method
- Patent number 9,293,338
- Issue date Mar 22, 2016
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD
- Publication number 20160155684
- Publication date Jun 2, 2016
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- CHANG-MING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND PACKAGING METHOD
- Publication number 20150303159
- Publication date Oct 22, 2015
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Chang-Ming LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20150294949
- Publication date Oct 15, 2015
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20150287688
- Publication date Oct 8, 2015
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IC PACKAGING METHODS AND STRUCTURES
- Publication number 20140124927
- Publication date May 8, 2014
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- CHANG-MING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD
- Publication number 20140124929
- Publication date May 8, 2014
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- CHANG-MING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD
- Publication number 20140124914
- Publication date May 8, 2014
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- CHANG-MING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20140124928
- Publication date May 8, 2014
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- CHANG-MING LIN
- H01 - BASIC ELECTRIC ELEMENTS

Chang-Ming Lin

Person

Patents Grantslast 30 patents

Semiconductor packaging structure and method for forming the same

Semiconductor IC packaging methods and structures

Metal contact for semiconductor device

Semiconductor packaging structure

Metal contact for semiconductor device

Metal contact for chip packaging structure

Semiconductor packaging structure and method

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD

SEMICONDUCTOR DEVICE PACKAGE AND PACKAGING METHOD

CHIP PACKAGING STRUCTURE AND PACKAGING METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR IC PACKAGING METHODS AND STRUCTURES

SEMICONDUCTOR DEVICE AND FABRICATION METHOD

SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD

SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME