Chang Myung Ryu

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Cupertino, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic interconnect element with decreased conductor spacing
- Patent number 9,856,135
- Issue date Jan 2, 2018
- Invensas Corporation
- Chang Myung Ryu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic interconnect element with decreased conductor spacing
- Patent number 9,524,947
- Issue date Dec 20, 2016
- Invensas Corporation
- Chang Myung Ryu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making a microelectronic interconnect element with decrea...
- Patent number 8,900,464
- Issue date Dec 2, 2014
- Invensas Corporation
- Chang Myung Ryu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic interconnect element with decreased conductor spacing
- Patent number 8,461,460
- Issue date Jun 11, 2013
- Invensas Corporation
- Chang Myung Ryu
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC INTERCONNECT ELEMENT WITH DECREASED CONDUCTOR SPACING
- Publication number 20170096329
- Publication date Apr 6, 2017
- Invensas Corporation
- Chang Myung Ryu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC INTERCONNECT ELEMENT WITH DECREASED CONDUCTOR SPACING
- Publication number 20150087146
- Publication date Mar 26, 2015
- Invensas Corporation
- Chang Myung Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Making a Microelectronic Interconnect Element With Decrea...
- Publication number 20130341299
- Publication date Dec 26, 2013
- Chang Myung RYU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC SUBSTRATE OR ELEMENT HAVING CONDUCTIVE PADS AND MET...
- Publication number 20130186944
- Publication date Jul 25, 2013
- Tessera Interconnect Materials, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic substrate or element having conductive pads and met...
- Publication number 20100044860
- Publication date Feb 25, 2010
- Tessera Interconnect Materials, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic interconnect element with decreased conductor spacing
- Publication number 20100009554
- Publication date Jan 14, 2010
- Tessera, Inc.
- Chang Myung Ryu
- B81 - MICRO-STRUCTURAL TECHNOLOGY